StarCore expansions
StarCore expansions
By David Larner, Embedded Systems
September 6, 2001 (9:16 a.m. EST)
URL: http://www.eetimes.com/story/OEG20010906S0052
OSE Systems' real-time operating system (RTOS) is being ported to Agere Systems' StarPro 2000 digital signal processor (DSP). The extended product is due to be available in November. StarPro2000 is targeted for emerging communications applications, such as third generation (3G) wireless infrastructure. OSE for StarPro 2000 features shared memory and shared pools support. To save memory the OSE kernel executes within the shared memory subsystem of the device. The Board Support Package (BSP) for StarPro 2000 supports interrupts and timers and lets the user access peripherals such as I/O ports and Direct Memory Access (DMA) controllers via RTOS APIs. Device drivers for various interfaces used by the OSE link handler are also included together with a description on how to add drivers to the BSP concept. OSE has also expanded its StarCore DSP core support with additional products designed for DSP and DSP/CPU development. The OSE RTOS' enhanced developmen t platform is built to facilitate design and development for multi-core, multi CPU/DSP heterogeneous embedded environments. The extended StarCore support is available now.
Related Semiconductor IP
- NFC wireless interface supporting ISO14443 A and B with EEPROM on SMIC 180nm
- DDR5 MRDIMM PHY and Controller
- RVA23, Multi-cluster, Hypervisor and Android
- HBM4E PHY and controller
- LZ4/Snappy Data Compressor
Related News
- Second StarCore DSP tuned for midrange apps
- Foundry expansions not expected to cause capacity glut
- Analog, StarCore strike at TI's lead with new DSPs
- European Commission clears StarCore DSP joint venture
Latest News
- CAST Releases First Dual LZ4 and Snappy Lossless Data Compression IP Core
- Arteris Wins “AI Engineering Innovation Award” at the 2025 AI Breakthrough Awards
- SEMI Forecasts 69% Growth in Advanced Chipmaking Capacity Through 2028 Due to AI
- eMemory’s NeoFuse OTP Qualifies on TSMC’s N3P Process, Enabling Secure Memory for Advanced AI and HPC Chips
- AIREV and Tenstorrent Unite to Launch Advanced Agentic AI Stack