SK hynix's memory chips next in Huawei's 5G phone saga
By Majeed Ahmad, EDN (September 8, 2023)
Last week’s relatively low-key launch of Huawei’ Mate 60 Pro 5G phone is still making waves for China’s breakthrough in cutting-edge semiconductor manufacturing technology with a 5G system-on-chip (SoC) produced on SMIC’s 7-nm process node. Especially, when SMIC doesn’t have access to extreme ultraviolet (EUV) lithography equipment.
While trade media has constantly been digging in for more details, social media in China is celebrating this breakthrough in semiconductor technology. According to Dan Hutcheson, vice-chair of TechInsights, nearly two-thirds of silicon in Huawei’s 5G phone is homegrown, and it’s a major advance.
To read the full article, click here
Related Semiconductor IP
- 6-bit, 12 GSPS Flash ADC - GlobalFoundries 22nm
- LunaNet AFS LDPC Encoder and Decoder IP Core
- ReRAM NVM in DB HiTek 130nm BCD
- UFS 5.0 Host Controller IP
- PDM Receiver/PDM-to-PCM Converter
Related News
- SK Hynix to Acquire Link_A_Media Devices
- SK Hynix Introduces DDR3L-Reduced Standby for Mobile Solutions
- Rambus Receives Decision in SK Hynix Case
- Rambus and SK Hynix Sign Patent License Agreement
Latest News
- TES unveils a next-generation Elliptic Curve Digital Signature Algorithm (ECDSA) IP Core for Secure IoT, Blockchain, and Industrial Systems
- Seligman Ventures Leads Cognichip’s $60M Series A to Back Physics-Informed AI for Chip Design, Intel CEO Lip-Bu Tan and Seligman Ventures’ Umesh Padval Join the Board
- SEMI Projects Double-Digit Growth in Global 300mm Fab Equipment Spending for 2026 and 2027
- Intel to Repurchase 49% Equity Interest in Ireland Fab Joint Venture
- AGI CPU: Arm’s $100B AI Silicon Tightrope Walk Without Undermining Its Licensees