RIVAI Launched China’s First Fully Self-Developed High- Performance RISC-V Server Chip
April 18, 2025 -- Recently, RIVAI officially unveiled its next-generation high-performance processor, Lingyu, in Qianhai, Shenzhen. As China’s first fully self-developed high-performance RISC-V server chip, Lingyu is up to international mainstream standards in computing power, energy efficiency, and interface configuration, making it suitable for scenarios such as high-performance computing (HPC), all-flash storage, and large open-source language models like DeepSeek.
Lingyu processor is built on RIVAI’s independently developed CPU core IP and on-chip network IP, achieving advanced out-of-order execution, high-speed data paths, and a mesh interconnect architecture. Through a co-optimization approach combining hardware-software co-design and process design, the chip introduces innovations across product engineering, EDA toolchain, physical design, and wafer manufacturing processes, significantly improving energy efficiency and reducing total cost of ownership (TCO).
To read the full article, click here
Related Semiconductor IP
- 64 bit RISC-V Multicore Processor with 2048-bit VLEN and AMM
- RISC-V AI Acceleration Platform - Scalable, standards-aligned soft chiplet IP
- 32 bit RISC-V Multicore Processor with 256-bit VLEN and AMM
- All-In-One RISC-V NPU
- ISO26262 ASIL-B/D Compliant 32-bit RISC-V Core
Related News
- VyperCore plans 5nm RISC-V server chip and card
- RISC-V Breakthrough: SpacemiT Develops Server CPU Chip V100 for Next-Generation AI Applications
- InCore Unveils Six-Core RISC-V Test Chip To Accelerate Design Adoption
- Fractile Licenses Andes Technology's RISC-V Vector Processor as It Builds Radical New Chip to Accelerate AI Inference
Latest News
- EXTOLL received GlobalFoundries Award for “Interface IP Partner of the Year”
- AiM Future and Franklin Wireless Sign MOU to Jointly Develop Lightweight AI Model and High-Efficiency 1 TOPS AI SoC Chipset
- GlobalFoundries and Silicon Labs Partner to Scale Industry-Leading Wi-Fi Connectivity
- GlobalFoundries Announces Availability of 22FDX+ RRAM Technology for Wireless Connectivity and AI Applications
- GlobalFoundries Announces Production Release of 130CBIC SiGe Platform for High-Performance Smart Mobile, Communication and Industrial Applications