Princeton finds bugs in RISC-V architecture
April 19, 2017 // By Peter Clarke, EENews Europe
Researchers at Princeton University have discovered a series of memory-consistency errors in high-performance implementations of the RISC-V processor instruction specification.
If uncorrected these errors could cause hard-to-debug errors, crashes and security vulnerabilities in software on RISC-V chips, the research team said, but added that changes are being made to the specification ahead of a "formal release" of the ISA later in 2017.
RISC-V is an open-source instruction set architecture originally developed for research and education but which is now becoming a standard open architecture for industry implementations with backing from numerous companies including AMD, Google, Hewlett Packard, Huawei, IBM, Micron, Microsemi, Microsoft, Nvidia, NXP, Rambus, Qualcomm, Samsung and Western Digital. The technology, if widely adopted, could be disruptive to the business models of established IP licensors such as ARM and Imagination.
To read the full article, click here
Related Semiconductor IP
- Compact Embedded RISC-V Processor
- Highly configurable HW PQC acceleration with RISC-V processor for full CPU offload
- Vector-Capable Embedded RISC-V Processor
- Tiny, Ultra-Low-Power Embedded RISC-V Processor
- Enhanced-Processing Embedded RISC-V Processor
Related News
- Phison Selects Andes RISC-V Cores for its First aiDAPTIV+ AI Solution, Marking a Major Milestone in AI Architecture
- TransEDA tool aims to catch bugs earlier, improve design reuse
- 0-In Announces Breakthrough Deep Counterexample Technology to Find the Toughest RTL Bugs Before Silicon
- Huaxintong Semiconductor licenses ARMv8-A architecture
Latest News
- TASKING Delivers Advanced Worst-Case Timing Coupling Analysis and Mitigation for Multicore Designs
- Efficient Computer Raises $60 Million to Advance Energy-Efficient General-Purpose Processors for AI
- QuickLogic Announces $13 Million Contract Award for its Strategic Radiation Hardened Program
- Cadence Reports Fourth Quarter and Fiscal Year 2025 Financial Results
- Renesas Develops 3nm TCAM Technology Combining High Memory Density and Low Power, Suitable for Automotive SoCs