Qualcomm licenses CDMA chip technology to Via
Qualcomm licenses CDMA chip technology to Via
By Semiconductor Business News
June 25, 2003 (4:37 p.m. EST)
URL: http://www.eetimes.com/story/OEG20030625S0027
SAN DIEGO Qualcomm Inc. on Wednesday (June 25) said it has licensed its second- and third-generation CDMA chip technology to Taiwan's Via Technologies Inc. Qualcomm has licensed its cdmaOne and cdma2000 technology to Via Telecom, based here, which is part of Taipei-based PC chip-set house Via. The assignment of the royalty-bearing license agreement enables Via Telecom to develop, manufacture and sell cdmaOne and CDMA2000 1X ASICs. "This agreement allows us to provide our wireless customers with a baseband processor solution, for use in a wide variety of CDMA2000 devices offering voice, data and GPS-enabled applications, which will help deliver time-to-market and product differentiation advantages keyed by the CDMA standard," Ker Zhang, CEO of VIA Telecom, said in a statement. The license assignment comes as a result of VIA Telecom's acquisition of LSI Logic's CDMA Wireless Division, which entered into a licensee agreement with Qua lcomm in 1997.
Related Semiconductor IP
- NFC wireless interface supporting ISO14443 A and B with EEPROM on SMIC 180nm
- DDR5 MRDIMM PHY and Controller
- RVA23, Multi-cluster, Hypervisor and Android
- HBM4E PHY and controller
- LZ4/Snappy Data Compressor
Related News
- Fractile Licenses Andes Technology's RISC-V Vector Processor as It Builds Radical New Chip to Accelerate AI Inference
- VIA Telecom Licenses ARM Core for CDMA Design
- Accelerated Technology's Nucleus RTOS Continues Support for CDMA Chipset from VIA Telecom
- CEVA Extends its CDMA Market Reach With VIA Telecom's Latest Design Wins
Latest News
- CAST Releases First Dual LZ4 and Snappy Lossless Data Compression IP Core
- Arteris Wins “AI Engineering Innovation Award” at the 2025 AI Breakthrough Awards
- SEMI Forecasts 69% Growth in Advanced Chipmaking Capacity Through 2028 Due to AI
- eMemory’s NeoFuse OTP Qualifies on TSMC’s N3P Process, Enabling Secure Memory for Advanced AI and HPC Chips
- AIREV and Tenstorrent Unite to Launch Advanced Agentic AI Stack