Jennic opens third international sales office and appoints John Morris as vice president - Americas
Sheffield, UK, 10 October 2005: Jennic has appointed John Morris as vice president of it Americas operation, with the opening of its new office based in San Diego, CA. This is the company's third international sales and support office, after recently establishing local operations in Taiwan and Japan. Morris will be responsible for building out the Americas' office sales team including local, in-country support and field sales. The Americas operation will include a network of local factory representatives and distribution.
John Morris joins the company from Figure 8 Wireless, a division of Chipcon, where he was vice president of ZigBee marketing. Morris has been a key player in the wireless and wired device networking space for over a decade, with senior level positions in a number of pioneering companies including Echelon Corporation and most recently Chipcon/Figure 8 Wireless.
Mike Clancy, VP of worldwide sales for Jennic commented, "John is going to be a tremendous asset for the company, and he brings a wealth of experience to the company, especially with his strong background in IEEE802.15.4 and ZigBee related activity." He added, "At Jennic we are rapidly building our worldwide sales, distribution and partner network as we gear up for volume production of our single-chip wireless microcontroller. North America is increasingly becoming important as the emerging IEEE802.15.4/ZigBee market is quickly gaining traction, particularly in the lighting, building automation and healthcare sectors."
Jennic recently launched the JN5121, a single chip IEEE802.15.4-compliant wireless microcontroller that is a complete system-on-chip featuring a 2.4GHz radio, analog peripheral blocks and digital sub-system based on a 32-bit RISC processor and memory. The product addresses a diverse range of applications, ranging from simple point-to-point wireless to proprietary mesh networks and ZigBee. Mike Clancy commented, "This is an emerging market but has potential to grow rapidly. Having John on board will ensure that we are able to aggressively build Jennic's position as a leading supplier for wireless sensor network application designs in the Americas."
About Jennic
Jennic is a fabless semiconductor company leading the wireless connectivity revolution into new applications. Its expertise in systems and software combined with world class RF and digital chip design provides low cost, highly integrated silicon solutions for the low power short range wireless data market with a focus on the IEEE802.15.4 and ZigBee standards. The company's products include state-of-the-art low power wireless microcontrollers, transceivers and low cost development platforms. Headquartered in Sheffield, UK, and employing over 60 people, Jennic is privately held and has a track record of successful silicon chip development for wireless applications over the last nine years.
Related Semiconductor IP
- 12-bit, 400 MSPS SAR ADC - TSMC 12nm FFC
- 10-bit Pipeline ADC - Tower 180 nm
- Simulation VIP for Ethernet UEC
- Automotive Grade PLLs, Oscillators, SerDes PMAs, LVDS/CML IP
- CAN-FD Controller
Related News
- Jasper Design Automation Continues to Accelerate Its Global Growth with Appointment of Coby Hanoch as New Vice President of International Sales
- MoSys Appoints John Monson as Vice President of Marketing
- Kilopass Appoints Tatsuya Yamazaki Vice President of Business Development Asia-Pacific To Accelerate International Expansion
- Breker Verification Systems Appoints Andy Stein Vice President of Worldwide Sales as Company Scales New Business Opportunities
Latest News
- Qualitas Semiconductor Demonstrates Live of PCIe Gen 6.0 PHY and UCIe v2.0 Solutions at ICCAD 2025
- WAVE-N v2: Chips&Media’s Custom NPU Retains 16-bit FP for Superior Efficiency at High TOPS
- Quintauris releases RT-Europa, the first RISC-V Real-Time Platform for Automotive
- PQShield's PQCryptoLib-Core v1.0.2 Achieves CAVP Certification for a broad set of classical and post-quantum algorithms
- M31 Debuts at ICCAD 2025, Empowering the Next Generation of AI Chips with High-Performance, Low-Power IP