MoSys Appoints John Monson as Vice President of Marketing
SANTA CLARA, Calif.--February 24, 2012--MoSys (NASDAQ: MOSY), a provider of serial chip-to-chip communications solutions that deliver unparalleled bandwidth performance for next generation networking systems and advanced system-on-chip (SoC) designs, today announced the appointment of John Monson as Vice President of Marketing. Monson will be responsible for all product marketing and will play a significant role in the strategic direction of the company. Monson will report directly to Len Perham, MoSys' President and Chief Executive Officer.
“John joins MoSys with extensive experience in the semiconductor industry and a proven track record for strategically targeting markets, defining products and successfully bringing those products into the marketplace,” said Perham. “I am excited to have John on board and look forward to his support driving MoSys down the path to being an IP-rich fabless semiconductor company in 2012 and beyond.”
Monson has more than 20 years of experience in engineering, marketing and sales with leading edge technology companies. Most recently, he was vice president of marketing for Mellanox Technologies where he was responsible for worldwide marketing and the implementation of marketing initiatives designed to expand penetration in key markets. Prior to Mellanox, he was vice president of marketing and business development for Inphi Corporation where he managed the EDC/PhyOptik business line. Further, he was vice president of sales and marketing for Scintera Networks with responsibility for strategy, product marketing and business development. His background also includes eight years at PMC-Sierra in executive and senior management positions in marketing and sales where he was instrumental in establishing PMC in the market and enabling the company’s growth. Prior to joining PMC-Sierra, he spent seven years at Lucent Technologies where he served in strategic sales and product marketing positions in Lucent’s mass storage and wireless product lines. Previously, he was the strategic marketing manager at Honeywell Solid State Electronics Center and held engineering and marketing positions at VTC Incorporated.
As an inducement material to Monson’s employment, in accordance with NASDAQ Stock Market Rule 5635(c)(4), the company has granted him a stock option to purchase 175,000 shares of common stock at an exercise price of $3.92 per share, which equals the closing price of a share of MoSys common stock on the NASDAQ Global Market on February 23, 2012.
About MoSys, Inc.
MoSys, Inc. (NASDAQ: MOSY) is a provider of high-performance networking memory solutions and high-speed, multi-protocol serial interface intellectual property (SerDes IP). MoSys' leading edge Bandwidth Engine® ICs combine the company's patented 1T-SRAM® high-density memory with its SerDes IP and are initially targeted at providing breakthroughs in bandwidth and access performance in next generation networking systems. MoSys’ SerDes IP and DDR3 PHYs support a wide range of data rates across a variety of standards, while its 1T-SRAM memory cores provide a combination of high-density, low-power consumption, high-speed and low cost advantages for high-performance applications. MoSys is headquartered in Santa Clara, California. More information is available on MoSys' website at www.mosys.com.
Related Semiconductor IP
- NFC wireless interface supporting ISO14443 A and B with EEPROM on SMIC 180nm
- DDR5 MRDIMM PHY and Controller
- RVA23, Multi-cluster, Hypervisor and Android
- HBM4E PHY and controller
- LZ4/Snappy Data Compressor
Related News
- LogicVision Names Ronald H. Mabry VP Marketing and Business Development
- What's needed for mixed-signal verification (by Bijan Kiani, Synopsys VP of Marketing)
- CoWare Names Joy E. Leo SVP & CFO and A.K. Kalekos VP of Marketing & Business Development as Demand for Company's ESL Solutions Intensifies
- John Geis joins Ingot as VP of Sales
Latest News
- CAST Releases First Dual LZ4 and Snappy Lossless Data Compression IP Core
- Arteris Wins “AI Engineering Innovation Award” at the 2025 AI Breakthrough Awards
- SEMI Forecasts 69% Growth in Advanced Chipmaking Capacity Through 2028 Due to AI
- eMemory’s NeoFuse OTP Qualifies on TSMC’s N3P Process, Enabling Secure Memory for Advanced AI and HPC Chips
- AIREV and Tenstorrent Unite to Launch Advanced Agentic AI Stack