India Prepares to Build Nation's First Chip Fab
By Alan Patterson, EETimes (May 10, 2022)
India is edging toward the construction of its first IC fab in the southwestern state of Karnataka following ISMC’s recent announcement.
The project would invest about $3 billion in a 65–nm analog chip fab, according to a statement by India’s Next Orbit Ventures, a fund management firm that aims to kickstart the effort. Israel’s Tower Semiconductor said it will be a technology provider for the project.
“If and when this project should take place, Tower will be only an integrator and a technology partner,” Tower spokeswoman Shahar Orit told EE Times. Orit declined to provide details, citing Tower’s expected acquisition by Intel. Intel also declined to comment due to the acquisition of Tower having yet to be formally approved.
To read the full article, click here
Related Semiconductor IP
- Root of Trust (RoT)
- Fixed Point Doppler Channel IP core
- Multi-protocol wireless plaform integrating Bluetooth Dual Mode, IEEE 802.15.4 (for Thread, Zigbee and Matter)
- Polyphase Video Scaler
- Compact, low-power, 8bit ADC on GF 22nm FDX
Related News
- Slow India may lose Cricket wafer fab
- India Doesn't Need Its Own Fab
- India set for fab
- Government of India creating enabling environment for Semiconductor Design Community with direct access to National Chip Design Infrastructure
Latest News
- How hardware-assisted verification (HAV) transforms EDA workflows
- BrainChip Provides Low-Power Neuromorphic Processing for Quantum Ventura’s Cyberthreat Intelligence Tool
- Ultra Accelerator Link Consortium (UALink) Welcomes Alibaba, Apple and Synopsys to Board of Directors
- CAST to Enter the Post-Quantum Cryptography Era with New KiviPQC-KEM IP Core
- InPsytech Announces Finalization of UCIe IP Design, Driving Breakthroughs in High-Speed Transmission Technology