IC4IC™ Conects with Tensilica® Technology

Xtensa® Processor chosen for Future 3G X-cess™ Family

February 25, 2002, Santa Clara, California. IC4IC Inc., an Israel-based company developing VLSI solutions for the emerging 3G wireless infrastructure markets, has licensed Xtensa technology from Tensilica Inc., the privately-held configurable and extensible microprocessor pioneer. According to IC4IC, Xtensa technology will be embedded into the system-on-chip (SOC) ICs in the firm's X-cess product line. These products support smooth migration of wireless access networks from voice to wireless data (ATM/TDM to IP).

Yosi Zatelman, vice president of engineering and IC4IC founder, said, "We are very enthusiastic about the potential of Tensilica's Xtensa architecture for our future 3G wireless products. Industry-proven Xtensa technology will allow us to achieve maximum SOC performance with uniquely tailored processors, and will materially accelerate our time to market."

"We are very pleased to welcome IC4IC to our customer family," said Bernie Rosenthal, Tensilica's senior vice president of marketing and business development. "This engagement continues our growth in the Israeli market."
 
 

About IC4IC

Intellectual Capital for Integrated Circuits, IC4IC Inc., was founded in January 2001 by a team of experienced ASIC engineers to develop VLSI solutions for the Access Networks market segment based on cutting-edge VLSI technologies. IC4IC X-cess Family is a System-on-a-chip IC that supports low-speed ATM & IP access for fixed wireless and wireline remote access applications. X-cess Offers smooth migration by supporting today's and tomorrow's standards: From GSM/GPRS to UMTS; From ATM to IPv4/v6; From IPv4 to IPv6. IC4IC is backed by Israeli VC firms as well as by TranSwitch Corporation (NASDAQ: TXCC). IC4IC's address is P.O.Box: 600, Yokneam Illit Israel, 20692. Phone +972-4-9594644, fax is +972-4-9594944 URL: http://www.ic4ic.co.il
 
 

About Tensilica, Inc.
Tensilica was founded in July 1997 to address the fast-growing market for configurable processors and software development tools for high volume, embedded systems. Using the company's proprietary Xtensa Processor Generator, system-on-chip (SOC) designers can develop a processor subsystem hardware design and a complete software development tool environment tailored to their specific requirements in hours. Tensilica's solutions provide a proven, easy-to-use, methodology that enables designers to achieve optimum application performance in minimum design time. The Company has over 140 engineers engaged in research, development, and customer support from its offices in in Santa Clara, California; Burlington, Massachusetts; Princeton, NJ; Austin, Texas; Raleigh, NC; Oxford, U.K.; Stockholm, Sweden; Taipei, Taiwan, R.O.C.; and Yokohama, Japan. Tensilica is headquartered in Santa Clara, California  (95054) at 3255-6 Scott Boulevard, and can be reached at (408) 986-8000 or via www.tensilica.com on the World Wide Web.

Editors’ Notes:

“Tensilica” and "Xtensa" are registered trademarks belonging to Tensilica, Inc. All other registered trademarks or
trademarks are property of their respective owners.

Tensilica's announced licensees are Avision, Berkeley Wireless Research Center, Broadcom, Cisco Systems, Conexant Systems, FUJIFILM Microdevices, Fujitsu Ltd., Hughes Network Systems, Ikanos Communications, JNI Corporation, Marvell (Galileo Technology), Mindspeed Technologies, National Semiconductor, NEC Networks, NEC Solutions, Nippon Telephone and Telegraph (NTT), ONEX Communications, Osaka & Kyoto Universities, TranSwitch Corporation, Victor Company of Japan (JVC) and ZiLOG.