Microsoft Employs Cadence Tensilica Processors in Xbox One
The Linley Group takes a deep dive into the Xbox One in its Microprocessor Report
SAN JOSE, Calif., February 12, 2014—Cadence Design Systems, Inc. (NASDAQ: CDNS), a leader in global electronic design innovation, today announced that Microsoft utilized four Tensilica® processors in the Xbox One audio subsystem as noted in the Linley Group Microprocessor Report entitled, “Inside the Xbox One Mega-SoC” (subscription required).
“High-quality audio is a very important element to the overall gaming experience,” said Larry Przywara, director of audio/voice intellectual property (IP) marketing at Cadence. “Microsoft selected Tensilica HiFi technology because of the strong audio codec ecosystem support, with over 100 software packages already ported and optimized for HiFi. Microsoft leveraged our customization technology to quickly create the optimal solution to meet their high-quality audio requirements.”
For more information on Tensilica processors, visit http://ip.cadence.com/ipportfolio/tensilica-ip.
About Cadence
Cadence enables global electronic design innovation and plays an essential role in the creation of today’s integrated circuits and electronics. Customers use Cadence® software, hardware, IP, and services to design and verify advanced semiconductors, consumer electronics, networking and telecommunications equipment, and computer systems. The company is headquartered in San Jose, Calif., with sales offices, design centers, and research facilities around the world to serve the global electronics industry. More information about the company, its products, and services is available at www.cadence.com.
Related Semiconductor IP
- Rad-Hard GPIO, ODIO & LVDS in SkyWater 90nm
- 1.22V/1uA Reference voltage and current source
- 1.2V SLVS Transceiver in UMC 110nm
- 1.8V/3.3V GPIO With I2C Compliant ODIO in GF 55nm
- Verification IP for UALink
Related News
- Mirabilis Design Accelerates SoC Development with New System-Level IP Library for Cadence Tensilica Processors
- Report: Microsoft to become chip company with Xbox
- IBM delivers Power-based chip for Microsoft Xbox 360 worldwide launch
- Chartered and Microsoft Sign 65-Nanometer Manufacturing Agreement for Xbox 360 CPU
Latest News
- EXTOLL received GlobalFoundries Award for “Interface IP Partner of the Year”
- AiM Future and Franklin Wireless Sign MOU to Jointly Develop Lightweight AI Model and High-Efficiency 1 TOPS AI SoC Chipset
- GlobalFoundries and Silicon Labs Partner to Scale Industry-Leading Wi-Fi Connectivity
- GlobalFoundries Announces Availability of 22FDX+ RRAM Technology for Wireless Connectivity and AI Applications
- GlobalFoundries Announces Production Release of 130CBIC SiGe Platform for High-Performance Smart Mobile, Communication and Industrial Applications