eSilicon Optimizes Arm Processor For TAK IMAGING
SUNNYVALE, Calif. — April 04, 2007 - eSilicon Corporation, a pioneering semiconductor Value Chain Producer (VCP), today announced it has implemented an ARM926EJ-ST processor core for TAK Imaging, a leading provider of image processor solutions for the consumer photo printer market. The eSilicon® implementation of the core is 55% smaller than available pre-hardened cores, making it an ideal solution for the cost-sensitive photo printer market.
TAK Imaging needed a small, cost-effective solution for its digital printer chip. However, pre-hardened cores offered by foundries are typically optimized for maximum performance at the expense of power and area. eSilicon focused on design for minimal area when hardening the ARM® core. By targeting TAK Imaging's specific cache configuration and speed requirements, eSilicon was able to reduce the overall core size by more than half compared to other off-the-shelf, pre-hardened core offerings in the same process technology.
"We have seen a growing demand for specialized implementations of ARM processor cores in situations where either a pre-hardened core was not available in the required process technology, or where the available pre-hardened cores failed to meet our customers' needs," said Hugh Durdan, vice president of Marketing, eSilicon. "By using our ARM processor expertise and internal development techniques, we were able to design the core implementation to fit TAK Imaging's specific requirements."
"eSilicon's implementation of the ARM926EJ-S processor core enabled us to significantly reduce the die size and cost of our printer controller chip and enabled us to focus on the value-added application-level features of our solution rather than spending our time on the details of the physical implementation of the device," said Christian Joly, CEO, TAK Imaging.
About eSilicon Corporation
eSilicon, a pioneering semiconductor Value Chain Producer (VCP), provides a comprehensive suite of design, productization and manufacturing services, enabling a flexible, low-cost, lower-risk path to volume production. The company delivers chips to system original equipment manufacturers (OEMs) and fabless semiconductor companies who serve a wide variety of markets including the consumer, computer, communications and industrial segments. eSilicon - Enabling Your Silicon SuccessT. For more information, visit http://www.esilicon.com.
Related Semiconductor IP
- 12-bit, 400 MSPS SAR ADC - TSMC 12nm FFC
- 10-bit Pipeline ADC - Tower 180 nm
- Simulation VIP for Ethernet UEC
- CAN-FD Controller
- Bluetooth® Low Energy 6.2 PHY IP with Channel Sounding
Related News
- C-DAC partners with MosChip and Socionext for design of HPC Processor AUM based on Arm architecture
- eSilicon Takes TSMC OIP Ecosystem Forum Customers' Choice Award for Best Paper
- inSilicon's JPEG2000 Encoder Accelerates and Optimizes Next Generation Image Compression
- ARM Optimizes Beatnik Technology For Digital Audio Applications
Latest News
- Qualitas Semiconductor Demonstrates Live of PCIe Gen 6.0 PHY and UCIe v2.0 Solutions at ICCAD 2025
- WAVE-N v2: Chips&Media’s Custom NPU Retains 16-bit FP for Superior Efficiency at High TOPS
- Quintauris releases RT-Europa, the first RISC-V Real-Time Platform for Automotive
- PQShield's PQCryptoLib-Core v1.0.2 Achieves CAVP Certification for a broad set of classical and post-quantum algorithms
- M31 Debuts at ICCAD 2025, Empowering the Next Generation of AI Chips with High-Performance, Low-Power IP