Emerging Chip Interconnections Poised For Growth

SCOTTSDALE, Ariz., October 12, 2005 - Three emerging chip-to-chip interconnections: HyperTransport, PCI Express, and RapidIO are being increasingly integrated into semiconductors and systems, and shipments bearing these technologies will grow over the next several years, reports In-Stat (http://www.in-stat.com). “Each interconnection is finding applications in which to flourish,” says Chris Kissel, In-Stat analyst. “RapidIO has found a home interconnecting DSPs, HyperTransport has become the front-side bus and processor-to-processor interface for all AMD processors, and PCI Express is the new standard for board-level peripheral interconnects in all computing applications.”

A recent report by In-Stat found the following:

• PCI Express will experience the highest growth of all three interconnects rising from 8.7 million systems in 2004 to 283 million in 2009.

• Despite shrinking use in consumer applications, In-Stat is forecasting a 28% CAGR in the use of HyperTransport fueled by its success in computing and routing applications.  

• RapidIO is clearly a distant third in I/O wins; however, it has found a defensible position in telecommunications.

• Although each interconnect has roadmaps to higher speeds and bandwidth, each faces challenges overcoming jitter using current circuit board technology.  These challenges may eventually force a transition to optical interfaces.

The report, I/O, I/O, How Much Faster Can We Go: Chip-to-Chip Interconnects (#IN0502566ESCA), covers three emerging chip-to-chip interconnections: HyperTransport, PCI Express, and RapidIO. The report provides the origins and evolution of each interconnect, technical barriers and standards roadmaps, and forecasts for each interconnect in selected market applications.

Market Research from In-Stat

In-Stat offers a broad range of information resources and analytical assets to technology vendors, service providers, technology professionals, and market specialists worldwide. The company stands alone in its ability to integrate both supply-side and demand-side research methodologies into a single comprehensive view of technology markets and products. This capability relies on a unique ability to cover the entire value chain from engineering-level technology, through equipment, infrastructure, services and end-users.

In-Stat is a strategic segment of the $8 billion Reed Elsevier global information network, with access to an expansive worldwide electronic network, extensive technology databases and well-informed personnel. In-Stat analysts gain exceptional insight into geographic market places and specific technologies within markets such as electronics, cable and wireless. As a member of Reed Business Information, In-Stat is a division of the largest business-to-business publisher in the U.S.