CEO: UMC to get 91 new IPs based on 65-nm technologies
Katherine Chiu, Hsinchu; Wen-Yu Lang, DigiTimes.com
December 24, 2003 - United Microelectronics Corporation (UMC) is working with over 10 intellectual property (IP) suppliers to develop new technologies based on 65 nanometer (nm) processes that are expected to bring 91 new IPs, according to Jackson Hu, UMC’s CEO for design support.
Read more ....
Related Semiconductor IP
- Very Low Latency BCH Codec
- 5G-NTN Modem IP for Satellite User Terminals
- 400G UDP/IP Hardware Protocol Stack
- AXI-S Protocol Layer for UCIe
- HBM4E Controller IP
Related News
- Dolphin Integration introduces a new Panoply of Silicon IPs for reducing the 65 nm silicon area up to 10%
- Texas Instruments and Continental collaborate to deliver first 65 nm safety ARM Cortex microcontroller used in advanced automotive safety applications
- Dolphin Integration offers first standard cell library to enable a leakage reduction of 1/350 at 65 and 55 nm
- Dolphin Integration sets up a large range of sponsored IPs at 55 nm to reduce SoC power consumption by up to 70%
Latest News
- Axiomise Launches nocProve for NoC Verification
- CAST Debuts TSN-EP-10G IP for High-Performance, Time-Sensitive Networking Ethernet Designs
- Synopsys Introduces Software-Defined Hardware-Assisted Verification to Enable AI Proliferation
- AimFuture and ITM Semiconductor to Develop AI-Integrated Technology for Robotics and Mobility
- TSMC February 2026 Revenue Report