Apple and Intel first to use TSMC 3nm
By David Manners, ElectronicsWeekly (July 2, 2021)
Apple and Intel will be the first customers for TSMC’s 3nm process, reports the Nikkei, with Intel securing the higher volume.
The process is due to enter production in H2 2022.
Compared to 5nm, the 3nm process, has a 10-15% speed improvement at the same power or a power reduction of 25-30% at the same speed, with a logic density improvement of 1.7x, an SRAM density improvement of 1.2x and an analogue density improvement of 1.1x.
It is thought that the iPad will be first to get 3nm chips with the next generation of iPhone using the 4nm half-node.
To read the full article, click here
Related Semiconductor IP
- HiFi iQ DSP
- CXL 4 Verification IP
- JESD204E Controller IP
- eUSB2V2.0 Controller + PHY IP
- I/O Library with LVDS in SkyWater 90nm
Related News
- Analog Bits to Join Intel Foundry Services Chip Design Ecosystem Expanding 3nm IP Offerings
- Alphawave Semi Launches Industry's First 3nm UCIe IP with TSMC CoWoS Packaging
- Unveiling the Availability of Industry's First Silicon-Proven 3nm, 24Gbps UCIe™ IP Subsystem with TSMC CoWoS® Technology
- Intel, TSMC to detail 2nm processes at IEDM
Latest News
- SkyeChip’s UCIe 3.0 Advanced Package PHY IP for SF4X Listed on Samsung Foundry CONNECT
- Victor Peng Joins Rambus Board of Directors
- Arteris Announces Financial Results for the Fourth Quarter and Full Year 2025 and Estimated First Quarter and Full Year 2026 Guidance
- Arteris Network-on-Chip Technology Achieves Deployment Milestone of 4 Billion Chips and Chiplets
- RISC-V Pivots from Academia to Industrial Heavyweight