Digital Media Professionals (DMP) Unveils Next-Generation Edge AI SoC “Di1” Integrating Advanced AI Inference and Precision Real-Time 3D Ranging Engine 2025-05-19 06:54:00 SoC Architecture & Assembly
Secure-IC at Computex 2025: Enabling Trust in AI, Chiplets, and Quantum-Ready Systems 2025-05-16 16:54:00 Events & Conferences
Xiphera Partners with Siemens Cre8Ventures to Strengthen Automotive Security and Support EU Chips Act Sovereignty Goals 2025-05-16 12:36:00 Strategic Partnerships
NY CREATES and Fraunhofer Institute Announce Joint Development Agreement to Advance Memory Devices at the 300mm Wafer Scale 2025-05-16 12:22:00 Research Institutions
Flow Reaches Milestone: PPU Achieves End-to-End CPU Operations in Alpha Testing 2025-05-16 09:29:00 IP Cores & Design
Achronix Announces New VectorPath 815 FPGA Accelerator Card 2025-05-15 16:21:00 SoC Architecture & Assembly
Perforce Partners with Siemens for Software-Defined, AI-Powered, Silicon-Enabled Design 2025-05-15 14:25:00 EDA & Design Tools
Geopolitical Tensions Fuel a Wave of AI Chip Independence as US and Chinese CSPs Race to Develop In-House ASICs, Redefining the Market Landscape, Says TrendForce 2025-05-15 12:53:00 Analysis & Insight
Secafy Licenses Menta's eFPGA IP to Power Chiplet-Based Secure Semiconductor Designs 2025-05-14 14:43:00 Commercial Deals
M31 Technology: Strong Momentum in Advanced Nodes as 2nm IP Adoption Accelerates – Steady Growth in H1 2025-05-14 09:51:00 Financials
Arteris Announces Financial Results for the First Quarter and Estimated Second Quarter and Updated Full Year 2025 Guidance 2025-05-14 08:58:00 Financials
Rambus Delivers Industry-Leading Client Chipsets for Next-Generation AI PC Memory Modules 2025-05-14 06:47:00 SoC Architecture & Assembly