Samsung Develops Industry's First 3rd-generation 10nm-Class DRAM for Premium Memory Applications 2019-03-21 04:30:00 Chip
Synopsys Fusion Design Platform Extends Leadership at 7nm, Surpasses 100-Tapeout Milestone in First Year 2019-03-20 15:46:00 EDA
Synopsys Unveils TestMAX Family of Products to Address Critical and Evolving Test Challenges 2019-03-20 15:43:00 EDA
DATE 2019: eSilicon to present two papers on advanced floor planning techniques with the Polytechnic University of Catalonia 2019-03-20 01:45:00 Other
Imagination delivers new and enhanced developer tools for Android 2019-03-19 16:56:00 Embedded Systems
Arteris IP FlexNoC Interconnect & Resilience Package Licensed by Vayyar Imaging for ISO 26262-Compliant 3D Imaging Chips for Automotive Systems 2019-03-19 14:53:00 Deals
Number of 300mm IC Wafer Fabs Expected to Reach 121 in 2019 2019-03-18 10:17:00 Commentary / Analysis
Global Top Ten IC Foundries Ranked for 1Q19, with TSMC Expected to Reach 48.1% Market Share, Says TrendForce 2019-03-18 10:04:00 Commentary / Analysis
Andes Technology Strengthens the RISC-V EasyStart Alliance to 15 ASIC Design Service Partners 2019-03-18 09:20:00 Business
Baidu, Facebook and Microsoft work together to define the OCP Accelerator Module specification 2019-03-15 14:07:00 Other
Synopsys Delivers Industry's First USB4 Subsystem Verification Solution, VIP, and Test Suite for High-performance USB Architecture 2019-03-14 14:08:00 Verification IP
Mobile Semiconductor Licenses memory compilers to Sandia National Laboratories 2019-03-14 07:34:00 Deals