Gyrfalcon Technology and Sensory Deliver Enhanced AI Biometric Access on Edge Devices 2019-11-14 02:39:00 SoC Architecture & Assembly
New Cadence UltraLink D2D PHY IP for Die-to-Die Connectivity Enables High-Performance Applications with Cost-Effective Packaging 2019-11-13 20:21:00 IP Cores & Design
Secure-IC and Andes Technology jointly provide cybersecurity enhanced RISC-V cores 2019-11-13 13:21:00 IP Cores & Design
Rambus Announces Comprehensive PCI Express 5.0 Interface Solution 2019-11-13 07:20:00 IP Cores & Design
Silicon Wafer Area Shipments Fall for Fourth Consecutive Quarter 2019-11-12 16:04:00 Analysis & Insight
Aerendir Mobile Inc. and SiFive Inc. Collaborate to Accelerate the Adoption of AI-Enabled Processors 2019-11-12 15:38:00 SoC Architecture & Assembly
Synopsys DesignWare ARC Data Fusion IP Subsystem Incorporated by Himax in Their Artificial Intelligence WiseEye ASIC 2019-11-12 15:13:00 Commercial Deals
Xilinx Vitis Unified Software Platform Now Available for Download 2019-11-12 13:29:00 SoC Architecture & Assembly
Xilinx Announces the World's Highest Performance Adaptive Devices for Advanced ADAS and AD Applications 2019-11-12 13:25:00 SoC Architecture & Assembly
Rianta Releases Ethernet MAC/PCS/FEC IP Suite for ASICs targeting Datacenter, Networking and 5G Mobile Infrastructure 2019-11-12 10:53:00 IP Cores & Design
GOWIN Semiconductor Releases the First FPGA with Integrated Bluetooth Radio 2019-11-12 09:12:00 SoC Architecture & Assembly
New Smart Meter using Adesto's Memory and Communications Technologies Begins Pilot Program in Africa and Middle East 2019-11-12 04:37:00 Misc
Mentor introduces Tessent Safety ecosystem to meet IC test requirements of the autonomous vehicles era 2019-11-12 02:05:00 EDA & Design Tools
Samsung Foundry Deploys Industry-Leading Synopsys TestMAX XLBIST Dynamic In-System Test Solution for Automotive Safety 2019-11-11 15:08:00 Commercial Deals