Arm's powerful compute and graphics platform at the heart of the new Samsung Exynos 2100 2021-01-13 09:17:00 Commercial Deals
Synopsys and Socionext Expand Collaboration to Deploy HBM2E IP for 5-Nanometer Process in AI and High-Performance Computing SoCs 2021-01-12 14:15:00 Commercial Deals
CEVA Extends its Leadership in High Performance Scalable Sensor Hub DSPs with 2nd Generation SensPro Family 2021-01-12 13:29:00 IP Cores & Design
Arteris IP FlexNoc Interconnect and Resilience Package Licensed by Hailo for Artificial Intelligence (AI) Chip 2021-01-12 12:19:00 Commercial Deals
Secure-IC And Menta Co-Develop Solution To Optimize Embedded Cybersecurity 2021-01-12 09:45:00 Strategic Partnerships
SEGGER introduces new Open Flashloader for direct programming of any RISC-V system 2021-01-12 07:56:00 SoC Architecture & Assembly
Ambarella introduces CV5 high performance AI vision processor for single 8K and multi-imager AI cameras 2021-01-11 16:41:00 SoC Architecture & Assembly
ESD Alliance Reports Strong Electronic Design Automation Industry Revenue Growth for Q3 2020 2021-01-11 16:00:00 Analysis & Insight
Flex Logix Appoints Dana McCarty as Vice President of Sales and Marketing for AI Inference Products 2021-01-11 14:28:00 People & Leadership
DSP Concepts and Cambridge Consultants work to accelerate audio and voice innovation 2021-01-11 13:41:00 SoC Architecture & Assembly
Official Commercial Launch of Efficiera Ultra-Low Power AI Inference Accelerator IP Core 2021-01-11 08:16:00 IP Cores & Design
Achronix to List on Nasdaq Through Merger with ACE Convergence 2021-01-08 08:11:00 Strategic Partnerships
Kevin Steptoe Joins Palma Ceia SemiDesign as EVP Program Management 2021-01-07 16:41:00 People & Leadership
DSP Group Unveils DBM10 Low-Power Edge AI/ML SoC with Dedicated Neural Network Inference Processor 2021-01-07 15:13:00 SoC Architecture & Assembly
China Forecast to Fall Far Short of its "Made in China 2025" Goals for ICs 2021-01-07 08:25:00 Analysis & Insight