Powerful FPGA Design Creation and Simulation IDE Adds VHDL-2019 Support & OSVVM Enhancements 2021-01-20 08:01:00 EDA & Design Tools
Sondrel Selects Synopsys Fusion Design and Verification Platforms to Displace Legacy Design Tools 2021-01-19 15:11:00 EDA & Design Tools
Dual Mode Bluetooth v5.2 SW Link Layer, Protocol Stack SW, Profiles licensed for ultra-low power 22nm True Wireless (TWS) Earbuds SoC 2021-01-19 10:19:00 Commercial Deals
Renesas Launches New General-Purpose 64-Bit RZ/G2L Group of MPUs with Latest Arm Cortex-A55 for Improved AI Processing 2021-01-19 07:34:00 SoC Architecture & Assembly
PLDA Announces XpressLINK-SOC CXL Controller IP with Support for the AMBA CXS Issue B Protocol 2021-01-18 16:18:00 IP Cores & Design
Gartner Says Worldwide Semiconductor Revenue Grew 7.3% in 2020 2021-01-14 13:36:00 Analysis & Insight
BeagleBoard.org and Seeed Introduce the First Affordable RISC-V Board Designed to Run Linux 2021-01-14 08:23:00 SoC Architecture & Assembly
Ginger Lee Named Chief Financial Officer for Palma Ceia SemiDesign 2021-01-14 08:19:00 People & Leadership
TSMC to Kick off Mass Production of Intel CPUs in 2H21 as Intel Shifts its CPU Manufacturing Strategies, Says TrendForce 2021-01-14 08:14:00 Analysis & Insight
Arasan Announces the Immediate Availability of its 2nd Generation MIPI D-PHY v1.1 IP for TSMC 22nm Process Technology 2021-01-14 07:48:00 IP Cores & Design
Chips&Media Adds Extraordinary Features in the Next-Generation Video Codec IPs, introducing the WAVE6 Series 2021-01-14 07:42:00 IP Cores & Design
Andes Technology and Rafael Microelectronics Announce a Strategic Partnership to Provide High Power Efficiency Wireless IP Solutions for IoT Devices 2021-01-14 06:27:00 Strategic Partnerships
Syntiant Surpasses Milestone of 10 Million Processors Shipped 2021-01-13 10:20:00 SoC Architecture & Assembly
Value of Semiconductor Industry M&A Agreements Sets Record in 2020 2021-01-13 10:09:00 Analysis & Insight