TSMC Boosts Capital Expenditure Budget on Strong Outlook
By Alan Patterson, EETimes (January 17, 2021)
TAIPEI — Taiwan Semiconductor Manufacturing Co. (TSMC) has nearly doubled its capital expenditure budget for 2021 to as much as $28 billion on expectations of strong growth during the next few years.
In 2021, the world’s biggest chip foundry expects to invest between $25 billion and $28 billion in capex, compared with $17.2 billion last year. Out of this year’s budget, the company will allocate about 80% for its advanced process technologies, including 3nm, 5nm and 7nm. About 10% will go to advanced packaging and mask-making and the remaining 10%, for specialty technologies.
TSMC said the capital investment is aimed at higher growth opportunities underpinned by multi-year megatrends. Starting from 2021, high-performance computing (HPC) will become a new growth driver coming from big customers in a variety of market segments, according to the company. Another factor driving confidence is that 5nm demand is stronger than expected, TSMC said in a conference call with analysts on Thursday this week.
To read the full article, click here
Related Semiconductor IP
- MIPI D-PHY and FPD-Link (LVDS) Combinational Transmitter for TSMC 22nm ULP
- 12-bit, 400 MSPS SAR ADC - TSMC 12nm FFC
- General use, integer-N 4GHz Hybrid Phase Locked Loop on TSMC 28HPC
- Process/Voltage/Temperature Sensor with Self-calibration (Supply voltage 1.2V) - TSMC 3nm N3P
- 25MHz to 4.0GHz Fractional-N RC PLL Synthesizer on TSMC 3nm N3P
Related News
- TSMC Raises Capital Expenditure Plan on Improved Outlook
- TSMC Boosts Capital Budget Again, to $30B
- FRAM license boosts Ramtron's revenue outlook
- Venture capital investment gives Accent independence and boosts global expansion plans
Latest News
- Impinj and EM Microelectronic Announce Gen2X Licensing Agreement
- LTSCT and Andes Technology Sign Strategic IP Licensing Master Agreement to accelerate RISC-V Based Advanced Semiconductor Solutions
- Global Semiconductor Sales Increase 29.8% Year-to-Year in November
- BAE Systems Licenses Time Sensitive Networking (TSN) Ethernet IP Cores from CAST
- HBM4 Mass Production Delayed to End of 1Q26 By Spec Upgrades and Nvidia Strategy Adjustments