Grovf Inc. Releases Low Latency RDMA RoCE V2 FPGA IP Core for Smart NICs
2021-11-23 08:07:00
IP Cores & Design
Chiplet News Archive - Page 275 of 1945
MediaTek and TSMC Unveil the World's First 7nm 8K Resolution Digital TV System-on-Chip
2021-11-22 13:22:00
Foundries & Process Nodes
BrainChip Partners with MegaChips to Develop Next-Generation Edge-Based AI Solutions
2021-11-22 08:26:00
Commercial Deals
Announcing superfast, HD Audio & Video through HDMI 2.0 Tx & Rx PHY & Controller IP Cores uncompressed data transfer in 28HPC+ and 12FFC!
2021-11-22 07:21:00
Misc
Codasip Adopts Imperas for RISC-V Processor Verification
2021-11-22 06:09:00
EDA & Design Tools
Elmos adopts Arm Cortex-M IP for its next-generation automotive MCU based product family
2021-11-19 15:00:00
Commercial Deals
sureCore designs special high performance multi-port memory for Semidynamics AI chip
2021-11-18 16:45:00
Commercial Deals
UK Widens Probe of Nvidia-Arm Deal
2021-11-18 16:44:00
Analysis & Insight
Annual Revenue Growth to Skyrocket Among Top 25
2021-11-18 16:44:00
Analysis & Insight
Imperas Models - reference for the newly ratified RISC-V Specifications
2021-11-18 16:42:00
EDA & Design Tools
Access Advance Welcomes ZTE as a Licensor and Licensee of the HEVC Advance Patent Pool
2021-11-18 16:41:00
Legal & IP Strategy
GlobalFoundries, Ford to Address Auto Chip Supply and Meet Growing Demand
2021-11-18 16:41:00
Foundries & Process Nodes
Samsung and Its Foundry Partners Reveal Solutions for a Strong Design Infrastructure at 3rd SAFE Forum 2021
2021-11-18 08:26:00
Foundries & Process Nodes
DCD-SEMI joins CAN in Automation, a leading CAN manufacturers' group
2021-11-18 06:45:00
Misc
DVB-S2X/S2/S/T2/T/C Combo Demodulator/Decoder IP Cores licensed to America's leading TV Semiconductor Company
2021-11-18 01:51:00
Misc
Synopsys Full EDA Flow First to Achieve Samsung Foundry 4LPP Process Certification
2021-11-17 15:07:00
EDA & Design Tools
RISC-V Low-Power Embedded Processor IP Core Now Available from CAST
2021-11-17 13:21:00
IP Cores & Design
Renesas Enters FPGA Market with the First Ultra-Low-Power, Low-Cost Family Addressing Low-Density, High-Volume Applications
2021-11-17 08:45:00
SoC Architecture & Assembly
Synopsys 3DIC Compiler Qualified for Samsung Foundry's Multi-Die Integration Flow, Accelerating 2.5D and 3D Designs
2021-11-17 07:22:00
EDA & Design Tools
Siemens extends support of multiple IC design solutions for Samsung Foundry's latest process technologies
2021-11-17 03:29:00
EDA & Design Tools