Silex Insight launches high performance (2Tbps) SM4-GCM Multi-booster
2021-05-27 13:51:00
IP
Recent News
DCD-SEMI accelerates AES security with the latest IP Core
2021-05-27 13:43:00
IP
USB Promoter Group Announces USB Power Delivery Specification Revision 3.1
2021-05-27 12:22:00
Other
Siemens launches PCI Express 6.0 Questa Verification IP solution
2021-05-27 11:38:00
Verification IP
Precise-ITC launches 10G-1.6T Ethernet/FiberChannel/FlexO IP Core
2021-05-27 11:29:00
IP
AImotive launches aiWare4, featuring advanced wavefront processing, upgraded safety and low-power features
2021-05-27 11:22:00
IP
Arm battens down the spending hatches
2021-05-27 07:26:00
Commentary / Analysis
Cadence Unleashes Clarity 3D Solver on the Cloud for Straightforward, Secure and Scalable Electromagnetic Analysis of Complex Systems on AWS
2021-05-27 01:50:00
EDA
5G Ethernet Subsystem to reduce development time is now available
2021-05-26 16:09:00
IP
Imperas Simulation Reference Models selected by IAR Systems for Arm 64bit
2021-05-26 15:22:00
Embedded Systems
Synopsys Digital and Custom Design Platforms Certified for TSMC's Latest 3nm Process Technology
2021-05-26 15:18:00
EDA
eYs3D Microelectronics, Co. Raises $7 Million Series A from Leading Industry Strategic Investors for Vision/AI Chips
2021-05-26 14:25:00
Business
Hardent Joins Samsung SAFE IP Partner Program & Launches New Display IP Subsystem Solution in Collaboration with Rambus
2021-05-26 08:32:00
Other
Oracle adds Arm Neoverse-based cloud instances with OCI Ampere A1
2021-05-26 07:36:00
Deals
proteanTecs' UCT to be Exhibited at the TSMC 2021 Online Technology Symposiums for North America, Europe and Taiwan
2021-05-26 06:42:00
Other
Siemens expands Simcenter with AI-driven generative engineering for systems architectures
2021-05-26 04:14:00
EDA
Lattice sensAI Solution Stack Simplifies Deployment of AI/ML Models on Smart Edge Devices
2021-05-26 03:11:00
FPGA
Cadence Collaboration with Arm Enables Customers to Successfully Tape out Next-Generation Arm Mobile Designs
2021-05-26 02:25:00
EDA
Global 200mm Fab Capacity on Pace to Record Growth to Meet Surging Demand and Address Chip Shortage, SEMI Reports
2021-05-25 16:17:00
Commentary / Analysis
Synopsys Enables First-Pass Silicon Success for Early Adopters of Next-Generation Armv9 Architecture-based SoCs
2021-05-25 16:10:00
EDA
DCD-SEMI accelerates AES security with the latest IP Core
2021-05-27 13:43:00
IP
USB Promoter Group Announces USB Power Delivery Specification Revision 3.1
2021-05-27 12:22:00
Other
Siemens launches PCI Express 6.0 Questa Verification IP solution
2021-05-27 11:38:00
Verification IP
Precise-ITC launches 10G-1.6T Ethernet/FiberChannel/FlexO IP Core
2021-05-27 11:29:00
IP
AImotive launches aiWare4, featuring advanced wavefront processing, upgraded safety and low-power features
2021-05-27 11:22:00
IP
Arm battens down the spending hatches
2021-05-27 07:26:00
Commentary / Analysis
Cadence Unleashes Clarity 3D Solver on the Cloud for Straightforward, Secure and Scalable Electromagnetic Analysis of Complex Systems on AWS
2021-05-27 01:50:00
EDA
5G Ethernet Subsystem to reduce development time is now available
2021-05-26 16:09:00
IP
Imperas Simulation Reference Models selected by IAR Systems for Arm 64bit
2021-05-26 15:22:00
Embedded Systems
Synopsys Digital and Custom Design Platforms Certified for TSMC's Latest 3nm Process Technology
2021-05-26 15:18:00
EDA
eYs3D Microelectronics, Co. Raises $7 Million Series A from Leading Industry Strategic Investors for Vision/AI Chips
2021-05-26 14:25:00
Business
Hardent Joins Samsung SAFE IP Partner Program & Launches New Display IP Subsystem Solution in Collaboration with Rambus
2021-05-26 08:32:00
Other
Oracle adds Arm Neoverse-based cloud instances with OCI Ampere A1
2021-05-26 07:36:00
Deals
proteanTecs' UCT to be Exhibited at the TSMC 2021 Online Technology Symposiums for North America, Europe and Taiwan
2021-05-26 06:42:00
Other
Siemens expands Simcenter with AI-driven generative engineering for systems architectures
2021-05-26 04:14:00
EDA
Lattice sensAI Solution Stack Simplifies Deployment of AI/ML Models on Smart Edge Devices
2021-05-26 03:11:00
FPGA
Cadence Collaboration with Arm Enables Customers to Successfully Tape out Next-Generation Arm Mobile Designs
2021-05-26 02:25:00
EDA
Global 200mm Fab Capacity on Pace to Record Growth to Meet Surging Demand and Address Chip Shortage, SEMI Reports
2021-05-25 16:17:00
Commentary / Analysis
Synopsys Enables First-Pass Silicon Success for Early Adopters of Next-Generation Armv9 Architecture-based SoCs
2021-05-25 16:10:00
EDA