Fluent.ai Offers Embedded Voice Recognition for Cadence Tensilica HiFi 5 DSP-Based True Wireless Stereo Products
2023-01-26 16:46:00
Embedded Systems
Recent News
intoPIX to feature TicoXS FIP technology for premium 4K & 8K AVoIP wireless AV at ISE 2023
2023-01-26 10:33:00
Other
Sevya joins TSMC Design Center Alliance
2023-01-26 10:31:00
Other
Cadence Quantus FS Solution, a 3D Field Solver, Achieves Certification for Samsung Foundry's SF4, SF3E and SF3 Process Technologies
2023-01-26 08:10:00
EDA
Avery Design Systems and CoMira Announce Partnership To Enable UCIe-Compliant Chiplet Design
2023-01-25 15:22:00
Business
Weebit Nano nears productisation, negotiating initial customer agreements
2023-01-25 11:34:00
Business
Open Compute Project Foundation and JEDEC Announce a New Collaboration
2023-01-25 10:19:00
Other
VORAGO Technologies to Move All its Manufacturing Stateside in Strategic Partnership with SkyWater's Trusted Foundry
2023-01-24 15:55:00
Foundries
Nexperia invests in sustainable alternatives to batteries
2023-01-24 15:45:00
Business
New Wave DV Releases Two New SOSA-Aligned 3U VPX ACAP (FPGA) Modules
2023-01-23 16:37:00
Embedded Systems
AI Must Be Secured at the Silicon Level
2023-01-23 16:17:00
Commentary / Analysis
Electronic System Design Industry Reports Revenue of $3.8 Billion in Q3 2022, ESD Alliance Reports
2023-01-23 16:09:00
Commentary / Analysis
CEO Interview: Stephen Fairbanks of Certus Semiconductor
2023-01-23 16:02:00
Commentary / Analysis
Xiphera announces the first IP core for the quantum-secure xQlave™ product family
2023-01-23 15:20:00
IP
Accellera's Security Annotation for Electronic Design Integration Standard 1.0 Moves Toward IEEE Standardization
2023-01-23 14:53:00
Other
Accellera Announces the Formation of the Clock Domain Crossing Working Group
2023-01-23 14:51:00
Other
GUC Delivers its First TSMC N3 Chip and First AI-Optimized N5 Design Using Cadence Digital Solutions
2023-01-23 08:46:00
EDA
OIF Marks 25th Anniversary, Launches New Physical & Link Layer Working Group Electrical Project and Adds 112G VSR Clause to CEI 5.0 IA at Q1 Technical and MA&E Committees Meeting
2023-01-23 08:41:00
Other
The latest ASIL-B,C,D and ISO26262 Certified Silicon Proven Interface IP Cores are ready for immediate licensing
2023-01-23 01:00:00
Other
Comcores TSN technology and 5G communication expertise to be deployed in a significant EU funded project with pan-European partners
2023-01-20 14:26:00
Business
intoPIX to feature TicoXS FIP technology for premium 4K & 8K AVoIP wireless AV at ISE 2023
2023-01-26 10:33:00
Other
Sevya joins TSMC Design Center Alliance
2023-01-26 10:31:00
Other
Cadence Quantus FS Solution, a 3D Field Solver, Achieves Certification for Samsung Foundry's SF4, SF3E and SF3 Process Technologies
2023-01-26 08:10:00
EDA
Avery Design Systems and CoMira Announce Partnership To Enable UCIe-Compliant Chiplet Design
2023-01-25 15:22:00
Business
Weebit Nano nears productisation, negotiating initial customer agreements
2023-01-25 11:34:00
Business
Open Compute Project Foundation and JEDEC Announce a New Collaboration
2023-01-25 10:19:00
Other
VORAGO Technologies to Move All its Manufacturing Stateside in Strategic Partnership with SkyWater's Trusted Foundry
2023-01-24 15:55:00
Foundries
Nexperia invests in sustainable alternatives to batteries
2023-01-24 15:45:00
Business
New Wave DV Releases Two New SOSA-Aligned 3U VPX ACAP (FPGA) Modules
2023-01-23 16:37:00
Embedded Systems
AI Must Be Secured at the Silicon Level
2023-01-23 16:17:00
Commentary / Analysis
Electronic System Design Industry Reports Revenue of $3.8 Billion in Q3 2022, ESD Alliance Reports
2023-01-23 16:09:00
Commentary / Analysis
CEO Interview: Stephen Fairbanks of Certus Semiconductor
2023-01-23 16:02:00
Commentary / Analysis
Xiphera announces the first IP core for the quantum-secure xQlave™ product family
2023-01-23 15:20:00
IP
Accellera's Security Annotation for Electronic Design Integration Standard 1.0 Moves Toward IEEE Standardization
2023-01-23 14:53:00
Other
Accellera Announces the Formation of the Clock Domain Crossing Working Group
2023-01-23 14:51:00
Other
GUC Delivers its First TSMC N3 Chip and First AI-Optimized N5 Design Using Cadence Digital Solutions
2023-01-23 08:46:00
EDA
OIF Marks 25th Anniversary, Launches New Physical & Link Layer Working Group Electrical Project and Adds 112G VSR Clause to CEI 5.0 IA at Q1 Technical and MA&E Committees Meeting
2023-01-23 08:41:00
Other
The latest ASIL-B,C,D and ISO26262 Certified Silicon Proven Interface IP Cores are ready for immediate licensing
2023-01-23 01:00:00
Other
Comcores TSN technology and 5G communication expertise to be deployed in a significant EU funded project with pan-European partners
2023-01-20 14:26:00
Business