Eliyan Applauds Release of OCP's Latest Multi-die Open Interconnect Standard, BoW 2.0 2023-08-16 04:39:00 Misc
Global Semiconductor Industry on Track for 2024 Recovery but Near-Term Headwinds Remain, SEMI Reports 2023-08-16 04:32:00 Analysis & Insight
DVCon India 2023 | Keynote: "Journeying Beyond AI: Unleashing the Art of Verification" by Sivakumar P R, Founder & CEO, Maven Silicon 2023-08-16 04:12:00 Misc
Tachyum Achieves 192-Core Chip After Switch to New EDA Tools 2023-08-16 03:29:00 SoC Architecture & Assembly
Kneron Unveils the KL730 AI Chip, Propelling Low-Energy GPT Solutions at Scale 2023-08-16 01:21:00 SoC Architecture & Assembly
Arteris Wins Gold Stevie® Award in the 2023 International Business Awards® for Technical Innovation of the Year 2023-08-15 07:46:00 Misc
Intel and Synopsys Expand Partnership to Enable Leading IP on Intel Advanced Process Nodes 2023-08-15 07:42:00 Strategic Partnerships
CEVA Joins Samsung SAFE™ Foundry Program to Accelerate Chip Design for the Mobile, Consumer, Automotive, Wireless Infrastructure and IoT Markets 2023-08-14 13:36:00 Strategic Partnerships
OPENEDGES and Telechips Collaborates for Automotive Applications 2023-08-14 10:13:00 Commercial Deals
Bluetooth Dual Mode v5.3 RF Transceiver IP Cores in 22nm, 40nm, 55nm is Available for Immediate Licensing for TWS, Audio Chipsets and Automotive Applications 2023-08-14 01:38:00 Misc
Rambus Initiates $100 Million Accelerated Share Repurchase Program 2023-08-11 15:04:00 Strategic Partnerships
Socionext Strengthens Design and Development Capabilities with New Office in Bangalore, India 2023-08-11 07:42:00 Strategic Partnerships
Andes Technology and TetraMem Collaborate to Build Groundbreaking AI Accelerator Chip with Analog In-Memory Computing 2023-08-11 07:28:00 Commercial Deals
BrainChip and Edge Impulse Offer a Neuromorphic Deep Dive into Next-Gen Edge AI Solutions 2023-08-10 16:46:00 Misc
UCIe™ (Universal Chiplet Interconnect Express™) Consortium Releases its 1.1 Specification 2023-08-10 12:37:00 Misc