DVCon India 2023 | Keynote: "Journeying Beyond AI: Unleashing the Art of Verification" by Sivakumar P R, Founder & CEO, Maven Silicon
August 16, 2023 -- Get Ready for an Epic Tech Odyssey with the keynote, ‘Journeying Beyond AI: Unleashing the Art of Verification’, by P. R. Sivakumar, Founder, and CEO, Maven Silicon.
The semiconductor industry is undergoing a transformative shift, embracing novel design methodologies and innovative flows to meet the demands of a rapidly evolving technological landscape. In this keynote address, we will explore how these advancements, such as AI-driven Electronic Design Automation (EDA), System of Chips (SoCs) utilizing Chiplets with UCIe, and cutting-edge 2.5D and 3D advanced packaging techniques, are revolutionizing chip production. This transformative journey positions the semiconductor industry to emerge as a trillion-dollar market by 2030, fueled by the creation of complex chips boasting trillions of transistors.
The rise of disruptive technologies, such as AI, cloud computing, and autonomous vehicles, has sparked a pressing need for sophisticated SoCs and chips specially designed to cater to these domains. These intricate designs incorporate standard CPUs, GPUs, FPGAs, and specialized AI accelerators, providing the foundation for groundbreaking innovation. With AI serving as a key driver for progress, its pervasive influence is permeating every industry sector.
Within the realm of EDA, machine learning has emerged as a vital tool, significantly enhancing the efficiency of the design and verification processes. Leveraging the power of machine learning, we are propelled towards the adoption of AI-driven EDA, facilitating the creation of advanced chips that fuel the growth and proliferation of emerging technologies. During this keynote, we will delve into the uncharted territory of verification challenges stemming from these new designs. Furthermore, we will illustrate how AI-driven EDA empowers verification engineers to efficiently validate these state-of-the-art chips, enabling them to unleash their creative potential and innovate with unprecedented freedom.
To know more, click here
Related Semiconductor IP
- NFC wireless interface supporting ISO14443 A and B with EEPROM on SMIC 180nm
- DDR5 MRDIMM PHY and Controller
- RVA23, Multi-cluster, Hypervisor and Android
- HBM4E PHY and controller
- LZ4/Snappy Data Compressor
Related News
- Groundbreaking Formal Verification Further Enhances the Quality of CHERIoT-Ibex
- Europe takes a major step towards digital autonomy in supercomputing and AI with the launch of DARE project
- TSMC Intends to Expand Its Investment in the United States to US$165 Billion to Power the Future of AI
- Geopolitical Tensions Fuel a Wave of AI Chip Independence as US and Chinese CSPs Race to Develop In-House ASICs, Redefining the Market Landscape, Says TrendForce
Latest News
- CAST Releases First Dual LZ4 and Snappy Lossless Data Compression IP Core
- Arteris Wins “AI Engineering Innovation Award” at the 2025 AI Breakthrough Awards
- SEMI Forecasts 69% Growth in Advanced Chipmaking Capacity Through 2028 Due to AI
- eMemory’s NeoFuse OTP Qualifies on TSMC’s N3P Process, Enabling Secure Memory for Advanced AI and HPC Chips
- AIREV and Tenstorrent Unite to Launch Advanced Agentic AI Stack