Arasan Chip Systems Extends USB IP Offerings to Actel's CompanionCore Program
2007-03-06 16:06:00
IP
Chiplet News Archive - Page 1397 of 1940
Faraday USB IP Successfully Cracks into Mass Storage, Multimedia, and Communication Markets
2007-03-06 13:18:00
Deals
ARC Configurable Technology at the Heart of Three Generations of IPWireless 3G Broadband Solutions
2007-03-06 08:47:00
Deals
ARC International Announces New Licensing Agreements with Leading European Semiconductor Companies and Design Teams
2007-03-06 08:34:00
Deals
Enuclia Picks Tensilica's HiFi 2 Audio Engine For Flat Panel TV Chips
2007-03-06 07:25:00
Deals
Toshiba Selects Xilinx Spartan-3 Generation FPGAs for Latest LCD TVs
2007-03-06 02:21:00
FPGA
Xilinx Updates March Quarter Guidance
2007-03-06 01:00:00
Financial
Stretch Selects Tensilica Xtensa LX Processor and HiFi 2 Audio Engine to Power Second Generation S6000 Software Configurable Processor
2007-03-05 14:58:00
Deals
Lattice Announces LatticeECP2M FPGA Solution for PCI Express V1.1
2007-03-05 14:10:00
IP
ARM Announces Development Kit To Reduce Time-To-Market Of Mobile Gaming Platforms
2007-03-05 12:22:00
Embedded Systems
Virage Logic Expands in China with Distributor Relationships
2007-03-05 12:10:00
Business
Faster verification is the goal at ST
2007-03-05 10:47:00
Commentary / Analysis
Ittiam Systems Selects Altera's Stratix II FPGAs for Multi-Format High-Definition Video Decoder Engine
2007-03-05 10:26:00
FPGA
Stretch Unveils Second Generation Software Configurable Processor Architecture
2007-03-05 04:39:00
Chip
Faraday's Board Appointed John Hsuan as Chairman
2007-03-05 02:53:00
People
Imagination Technologies Shows Next Generation of Mobile Graphics Technologies at GDC 2007
2007-03-05 01:52:00
Other
FSA Announces Danny Biran of Altera to Join Its Board of Directors
2007-03-05 01:09:00
People
Broadcom Demonstrates New 65 Nanometer Dual Advanced Video Decoder Chip
2007-03-05 01:02:00
Chip
IntellaSys Unveils Industry's First 128-Bit, Hardware-Encrypted Controller Chip for USB 2.0 NAND Flash Memory Used in Thumb Drives
2007-03-05 01:00:00
Chip
New MOSIS Shared Wafer Service on IBM’s 130nm 8WL Process Makes High-Performance RF Chip Fabrication Affordable
2007-03-02 18:09:00
Foundries