Cadence Demonstrates Interoperability with SK hynix's Highest Speed LPDDR5T Mobile DRAM at 9600Mbps 2023-04-18 09:00:00 IP
Cadence Extends Collaboration with TSMC and Microsoft to Advance Giga-Scale Physical Verification in the Cloud 2023-04-17 18:35:00 EDA
DVB-S2X LDPC/ BCH Encoder and Decoder IP Core Available For Integration From Global IP Core 2023-04-17 09:13:00 IP
Introducing the Cutting-Edge USB 3.0/ PCIe 3.0 Combo PHY IP Core in 28HPC+ for High-Performance SoC Designs 2023-04-17 03:00:00 Other
Fraunhofer IIS partners with Avid to enable support of MPEG-H Audio in Pro Tools 2023-04-14 16:30:00 Embedded Systems
MainConcept and Fraunhofer IIS collaborate on MPEG-H Audio and xHE-AAC encoding for video and audio streaming services 2023-04-14 16:28:00 Embedded Systems
Experience the Future of Video Processing with intoPIX and Imagine Communications at the 2023 NAB Show 2023-04-14 16:23:00 Other
Cadence Introduces EMX Designer, Delivering More Than 10X Increased Performance for On-Chip Passive Component Synthesis 2023-04-14 10:51:00 EDA
Pragmatic Semiconductor Announces Appointment of Semiconductor Industry Veteran, David Moore, as CEO 2023-04-14 10:45:00 People
IAR Embedded Secure IP upgrades solutions portfolio with late-stage security 2023-04-14 10:39:00 Embedded Systems
Strict Restrictions Imposed by US CHIPS Act Will Lower Willingness of Multinational Suppliers to Invest; Chinese Semiconductor Development Will Be Limited for Next Decade, Says TrendForce 2023-04-14 10:21:00 Commentary / Analysis
Ateme and Fraunhofer Join Forces to Deliver Next Generation Audio 2023-04-13 18:46:00 Embedded Systems
EnSilica evaluation platform for EN62020 sensor interface ASIC speeds up development of wearable fitness and healthcare sensor devices 2023-04-13 18:46:00 Chip
Synopsys Introduces the Industry's First Emulation System with Unmatched Capacity to Enable Electronics Digital Twins of Advanced SoCs 2023-04-13 18:46:00 EDA