EnSilica enters strategic partners with design and custom module developer IndesmaTech
OXFORD, United Kingdom – December 11th 2023 – EnSilica (AIM: ENSI), a leading chip maker of mixed signal ASICs (Application Specific Integrated Circuits), has announced it has entered into a strategic partnership with the Denmark-headquartered design consultancy and custom module developer IndesmaTech.
The companies will collaborate to develop bespoke chips, modules and systems for IndesmaTech’s client roster across northern Europe, including throughout Germany, the UK and Scandinavia.
“The partnership helps us lower the cost of entry to companies considering taking an ASIC approach either for improved product performance or to protect the supply chain,” said Peter Jeuter, EnSilica’s VP of sales. “The ASIC market is traditionally split into two, with either very niche engineering teams seeking to create or break into a new market, or those who are already very established, this deal and the incredible experience of the team at IndesmaTech should help make ASICs more accessible to a greater number of companies in between.”
The strategic partnership deal was signed in Q4 2023.
Related Semiconductor IP
- DeWarp IP
- 6-bit, 12 GSPS Flash ADC - GlobalFoundries 22nm
- LunaNet AFS LDPC Encoder and Decoder IP Core
- ReRAM NVM in DB HiTek 130nm BCD
- UFS 5.0 Host Controller IP
Related News
- EnSilica and Codasip announce strategic partnership
- Graphcore and SiPearl: strategic partnership to combine artificial intelligence and high performance computing
- Synopsys Strategic Partnership with Samsung Foundry Accelerates Access to Transformative 3nm GAA Technology
- Ventana Micro Systems Inc. Announces Strategic Partnership With Intel for Broader Commercialization of Its High-Performance RISC-V Cores and Chiplets
Latest News
- Ultra Accelerator Link™ (UALink™) Consortium Publishes Four Specifications Defining In-Network Compute, Chiplets, Manageability and 200G Performance
- GUC Monthly Sales Report – March 2026
- Qualitas Semiconductor Licenses 2nm Process-Based MIPI C/D-PHY IP to U.S. Edge AI SoC Company
- Global Semiconductor Sales Increase Substantially in February
- Hardware Root of Trust Essential for AI Chip Integrity