Crypto Quantique and iMQ to enable quantum secure chip-to-cloud connection
2024-01-12 09:27:00
Business
Chiplet News Archive - Page 107 of 1922
Digital Core Design Presents D68000-CPU32+ for well-known 68k family
2024-01-11 16:48:00
IP
Crypto Quantique partners with Blaitek to enable quantum secure chip-to-cloud connection
2024-01-11 16:46:00
Business
Innatera unveils its groundbreaking ultra-low power neuromorphic microcontroller
2024-01-11 14:02:00
Other
Ceva and Actions Technology Commemorate Landmark Achievement, Surpassing 100 Million Ceva-Powered Wireless Audio and AIoT Processors Shipped
2024-01-10 15:43:00
Deals
Sunplus and Ceva Expand Collaboration to Bring Bluetooth Audio to the airlyra SoC Family for Wireless Speakers, Soundbars and other Wireless Audio Devices
2024-01-10 15:31:00
Deals
intoPIX Showcases Groundbreaking Sensorand Video Compression Technologies at CES 2024
2024-01-10 14:16:00
Other
GUC Tapes Out Complex 3D Stacked Die Design on Advanced FinFET Node Using Cadence Integrity 3D-IC Platform
2024-01-10 13:29:00
EDA
CEO interview: MIPS' Sameer Wasson on a RISC-V reboot
2024-01-10 13:03:00
Commentary / Analysis
CXL Overcomes Hierarchical Routing Limits
2024-01-10 09:52:00
Commentary / Analysis
TSMC December 2023 Revenue Report
2024-01-10 09:19:00
Financial
Global Semiconductor Sales Increase 5.3% Year-to-Year in November
2024-01-10 08:53:00
Commentary / Analysis
Packetcraft and Synopsys Collaborate to Deliver Turnkey Bluetooth Qualified 5.4 PAwR and LE Audio Solutions
2024-01-10 08:44:00
IP
SCALINX, Leading Fabless Semiconductor in System-on-a-Chip Design, Secures €34 Million in Second Round Funding
2024-01-10 02:40:00
Business
Atmosic Introduces the Multiprotocol ATM34/e Series Adding 802.15.4 Support for Thread and Matter to its Bluetooth LE Portfolio
2024-01-10 01:02:00
Chip
VeriSilicon extends watch GUI ecosystem in partnership with QDay Technology for enhanced user experience
2024-01-09 20:40:00
Embedded Systems
Andes Technology and Spacetouch Collaborate to Unveil High-Tech Edge-Side AI Audio Processor Featuring the Powerful RISC-V AndesCore™ D25F
2024-01-09 20:25:00
Deals
GUC Taped Out UCIe 32G IP using TSMC's 3nm and CoWoS Technology
2024-01-09 15:17:00
IP
Ceva and THX Ltd. Partner to Bring Premium Spatial Audio to Hearables, Consumer and Mobile Products
2024-01-09 13:29:00
Embedded Systems
Semiconductor Market: Rebound Expected in 2024, But Challenges Lie Ahead
2024-01-09 11:47:00
Commentary / Analysis