Global Semiconductor Materials Market Revenues Slip 1.1 Percent in 2019, SEMI Reports
MILPITAS, Calif. — March 31, 2020 — Global semiconductor materials market revenues edged down 1.1 percent in 2019, SEMI, the global industry association representing the electronics manufacturing and design supply chain, reported today in its Materials Market Data Subscription (MMDS).
While worldwide total wafer fabrication materials logged a slight decrease of 0.4 percent, from $33.0 billion to $32.8 billion, wafer fab materials, process chemicals, sputtering targets, and CMP registered declines of more than 2 percent year-over-year (YoY). Packaging materials slipped 2.3 percent, from $19.7 billion to $19.2 billion, in 2019. The only two categories to notch increases last year were substrate and other packaging materials.
For the 10th consecutive year, Taiwan, at $11.3 billion, was the largest consumer of semiconductor materials on the strength of its large foundry and advanced packaging base. Korea remained in the second spot, while, China, the only materials market to register an increase in 2019, was third. All other regions saw flat revenue or low single-digit declines.
Region | 2018** | 2019 | % Change |
Taiwan | 11.62 | 11.34 | -2.4% |
South Korea | 8.94 | 8.83 | -1.3% |
China | 8.52 | 8.69 | 1.9% |
Japan | 7.80 | 7.70 | -1.3% |
Rest of World* | 6.21 | 6.05 | -2.6% |
North America | 5.73 | 5.62 | -1.8% |
Europe | 3.89 | 3.89 | 0% |
Total | 52.73 | 52.14 | -1.1% |
Source: SEMI, March 2020
Note: Summed subtotals may not equal the total due to rounding.
* The ROW region is defined as Singapore, Malaysia, Philippines, other areas of Southeast Asia and smaller global markets.
** 2018 data have been updated based on SEMI data collection programs.
The SEMI Materials Market Data Subscription (MMDS) provides current revenue data along with seven years of historical data and a two-year forecast. The annual subscription includes four quarterly updates for the materials segment and reports revenue for seven market regions (North America, Europe, ROW, Japan, Taiwan, South Korea, and China). The report also features detailed historical data for silicon shipments and revenues for photoresist, photoresist ancillaries, process gases and leadframes.
For more information or to subscribe, please contact the SEMI Industry Research and Statistics Group at mktstats@semi.org .
About SEMI
SEMI® connects more than 2,100 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Association Partners, defined communities within SEMI focused on specific technologies. Visit www.semi.org to learn more
Related Semiconductor IP
- USB 20Gbps Device Controller
- Ultra-High-Speed Time-Interleaved 7-bit 64GSPS ADC on 3nm
- Fault Tolerant DDR2/DDR3/DDR4 Memory controller
- 25MHz to 4.0GHz Fractional-N RC PLL Synthesizer on TSMC 3nm N3P
- AGILEX 7 R-Tile Gen5 NVMe Host IP
Related News
- 2024 Global Semiconductor Materials Market Posts $67.5 Billion in Revenue
- Global Semiconductor Materials Market Revenue Reaches Record $73 Billion in 2022, SEMI Reports
- Faraday Reports Second Quarter 2019 Financial Results 2Q19 Revenues NT$1.2 Billion, Up 11% QoQ
- Global Top 10 IC Designers' 2019 Revenues Drop by 4.1% YoY, as Industry Growth to Face Challenges from COVID-19 Pandemic in 2020, Says TrendForce
Latest News
- Euclyd Unveils CRAFTWERK: The World’s Most Power-Efficient Exascale Token Factory for Agentic AI
- NVMe Aims For Annual Spec Updates
- MIPS Appoints Alan Li as Head of Business Development to Accelerate China Growth
- BrainChip Expands Global Reach, Announces Akida Boards and AI Development Kits Available at DigiKey
- Qualitas Semiconductor Successfully Demonstrates Live UCIe PHY IP at AI Infra Summit 2025