Foundation IP TSMC 55 nm uLP uLP eFlash IP
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79
IP
from 3 vendors
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10)
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High-Density eMRAM Compiler TSMC 22ULL
- eMRAM compiler enabling low-power designs requiring high memory capacity
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SerDes IP
- 10dB to 35dB bump-to-bump insertion loss
- Multi-rate support for 56Gbps to 112Gbps PAM4 and NRZ
- Integrated PLL
- Robust clock distribution architecture
- Advanced mixed signal analog equalization architecture
- Fully adaptive and programmable RX equalization
- Auto-negotiation
- Link Training
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CAT Trip Sensor, TSMC N3E
- Remote thermal sensor
- Central hub
- Small size
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Thermal Diode with Base Pin, TSMC N3E
- Easily integrated
- Sense die temperature using external current source
- Created using standard digital process layers.
- Small size
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Distributed Thermal Sensor (DTS) Non-Deep NWELL, TSMC N3E
- Small remote sensors
- Central hub
- High Accuracy
- High Resolution