Embedded Monitoring IP
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87
IP
from 16 vendors
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10)
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In-Chip Monitoring Subsystem for Process, Voltage & Temperature (PVT) Monitoring, TSMC N7
- PVT Subsystem supporting a configurable monitoring fabric
- Measurement of dynamic and static conditions in-chip
- Thermal profiling of silicon devices
- Supply voltage analysis during device ‘mission’ mode
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In-Chip Monitoring Subsystem for Process, Voltage & Temperature (PVT) Monitoring, TSMC N3E
- PVT Subsystem supporting a configurable monitoring fabric
- Measurement of dynamic and static conditions in-chip
- Thermal profiling of silicon devices
- Supply voltage analysis during device ‘mission’ mode
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In-Chip Monitoring Subsystem for Process, Voltage & Temperature (PVT) Monitoring, TSMC N4P
- PVT Subsystem supporting a configurable monitoring fabric
- Measurement of dynamic and static conditions in-chip
- Thermal profiling of silicon devices
- Supply voltage analysis during device ‘mission’ mode
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In-Chip Monitoring Subsystem for Process, Voltage & Temperature (PVT) Monitoring, TSMC N6
- PVT Subsystem supporting a configurable monitoring fabric
- Measurement of dynamic and static conditions in-chip
- Thermal profiling of silicon devices
- Supply voltage analysis during device ‘mission’ mode
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In-Chip Monitoring Subsystem for Process, Voltage & Temperature (PVT) Monitoring, TSMC N5
- PVT Subsystem supporting a configurable monitoring fabric
- Measurement of dynamic and static conditions in-chip
- Thermal profiling of silicon devices
- Supply voltage analysis during device ‘mission’ mode
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In-Chip Monitoring Subsystem for Process, Voltage & Temperature (PVT) Monitoring, TSMC 12FFC
- PVT Subsystem supporting a configurable monitoring fabric
- Measurement of dynamic and static conditions in-chip
- Thermal profiling of silicon devices
- Supply voltage analysis during device ‘mission’ mode
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In-Chip Monitoring Subsystem for Process, Voltage & Temperature (PVT) Monitoring, TSMC N3
- PVT Subsystem supporting a configurable monitoring fabric
- Measurement of dynamic and static conditions in-chip
- Thermal profiling of silicon devices
- Supply voltage analysis during device ‘mission’ mode
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In-Chip Monitoring Subsystem for Process, Voltage & Temperature (PVT) Monitoring, TSMC 28HPC+
- PVT Subsystem supporting a configurable monitoring fabric
- Measurement of dynamic and static conditions in-chip
- Thermal profiling of silicon devices
- Supply voltage analysis during device ‘mission’ mode
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In-Chip Monitoring Subsystem for Process, Voltage & Temperature (PVT) Monitoring, TSMC 16FFC
- PVT Subsystem supporting a configurable monitoring fabric
- Measurement of dynamic and static conditions in-chip
- Thermal profiling of silicon devices
- Supply voltage analysis during device ‘mission’ mode
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Tessent in-life monitoring
- Bus Monitor enables complete, transaction-level visibility of SoC bus activity across all major standards (AXI, ACE, OCP)
- Network-on-Chip (NOC) Monitor provides transaction-level visibility for devices using the Arm AMBA 5 Coherent Bus Interface (CHI)
- Status Monitors provides embedded logic analyzer capability
- Processor Analytics provides run-control, performance monitoring, cross triggering, and event driven control of embedded processors.