HBM IP for TSMC
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23
HBM IP
for TSMC
from 2 vendors
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10)
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TSMC CLN3FFP HBM4 PHY
- IGAHBMZ03A is a High Bandwidth Memory 4 Physical Layer (HBM4 PHY) that is compliant with JEDEC HBM4 DRAM Specification JESD270-4.
- Fabricated in the TSMC 3 nm Advanced process node (N3P), it supports the data rate up to 12 Gbps per data pin in the DDR PHY Interface (DFI)-like 1:4 clock frequency ratio (HBM4 controller clock: WDQS = 1:4).
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TSMC CLN7FF HBM3 PHY
- IGAHBMX03A is a HBM3 (High Bandwidth Memory) PHY IP compliant to the JEDEC HBM3 DRAM Specification Rev 0.95.
- Built on TSMC 7nm process node, it supports data rate up to 7200 Mbps per data pin with DFI 1:4 clock frequency ratio (controller clock : WCK = 1:4).
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HBM3 PHY V2 (Hard) - TSMC N3P
- Supports 2.5D-based JEDEC standard HBM3 DRAMs with data rates up to 9600 Mbps
- 16 independent 64-bit memory channels
- Pseudo-channel operation supported to enable up to 32 32-bit pseudo-channels with 1024-bit PHY
- Supports up to 4 trained frequencies with <5us switching time
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HBM2E PHY V2 - TSMC N5
- Complete HBM2/HBM2E IP solution, including PHY, controller and verification IP, reduces integration risk while minimizing time-to-market
- 2.5D interposer expertise and reference designs
- Supports 2.5D-based JEDEC standard HBM2/HBM2E SDRAMs with data rates up to 3200 Mbps
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HBM2E PHY V2 - TSMC 7FF18
- Complete HBM2/HBM2E IP solution, including PHY, controller and verification IP, reduces integration risk while minimizing time-to-market
- 2.5D interposer expertise and reference designs
- Supports 2.5D-based JEDEC standard HBM2/HBM2E SDRAMs with data rates up to 3200 Mbps
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HBM2E PHY V2 - TSMC 6FF18
- Complete HBM2/HBM2E IP solution, including PHY, controller and verification IP, reduces integration risk while minimizing time-to-market
- 2.5D interposer expertise and reference designs
- Supports 2.5D-based JEDEC standard HBM2/HBM2E SDRAMs with data rates up to 3200 Mbps
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HBM2E PHY V2 (Hard 1) - TSMC 7FF18
- Complete HBM2/HBM2E IP solution, including PHY, controller and verification IP, reduces integration risk while minimizing time-to-market
- 2.5D interposer expertise and reference designs
- Supports 2.5D-based JEDEC standard HBM2/HBM2E SDRAMs with data rates up to 3200 Mbps
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HBM2E PHY V2 (Hard 1) - TSMC 6FF18
- Complete HBM2/HBM2E IP solution, including PHY, controller and verification IP, reduces integration risk while minimizing time-to-market
- 2.5D interposer expertise and reference designs
- Supports 2.5D-based JEDEC standard HBM2/HBM2E SDRAMs with data rates up to 3200 Mbps
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HBM2E PHY V2 (Hard 1) - TSMC 5FF12
- Complete HBM2/HBM2E IP solution, including PHY, controller and verification IP, reduces integration risk while minimizing time-to-market
- 2.5D interposer expertise and reference designs
- Supports 2.5D-based JEDEC standard HBM2/HBM2E SDRAMs with data rates up to 3200 Mbps
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HBM3 PHY V2 - TSMC N5
- Supports 2.5D-based JEDEC standard HBM3 DRAMs with data rates up to 9600 Mbps
- 16 independent 64-bit memory channels
- Pseudo-channel operation supported to enable up to 32 32-bit pseudo-channels with 1024-bit PHY
- Supports up to 4 trained frequencies with <5us switching time