USB IP for TSMC
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		19
					USB IP
		
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- 3nm
 
- 
		USB 4.0 V2 PHY - 4TX/2RX, TSMC N3P , North/South Poly Orientation
- Supports 40 Gbps, 20 Gbps, 10 Gbps, and 5 Gbps data rates
 - Supports 480 Mbps, 12 Mbps, and 1.5 Mbps data rates
 - x1 and x2 configurations (USB 3.2 and USB 3.1 PHY only)
 - Low active and standby power
 - Small area for low silicon cost
 
					
	 - 
		USB4 PHY - TSMC N4P 1.2V, North/South Poly Orientation
- Supports 40 Gbps, 20 Gbps, 10 Gbps, and 5 Gbps data rates
 - Supports 480 Mbps, 12 Mbps, and 1.5 Mbps data rates
 - x1 and x2 configurations (USB 3.2 and USB 3.1 PHY only)
 - Low active and standby power
 - Small area for low silicon cost
 
					
	 - 
		USB4 PHY - TSMC N3E 1.2V, North/South Poly Orientation
- Supports 40 Gbps, 20 Gbps, 10 Gbps, and 5 Gbps data rates
 - Supports 480 Mbps, 12 Mbps, and 1.5 Mbps data rates
 - x1 and x2 configurations (USB 3.2 and USB 3.1 PHY only)
 - Low active and standby power
 - Small area for low silicon cost
 
					
	 - 
		USB4 PHY - TSMC N5 1.2V, North/South Poly Orientation
- Supports 40 Gbps, 20 Gbps, 10 Gbps, and 5 Gbps data rates
 - Supports 480 Mbps, 12 Mbps, and 1.5 Mbps data rates
 - x1 and x2 configurations (USB 3.2 and USB 3.1 PHY only)
 - Low active and standby power
 
					
	 - 
		USB 2.0 femtoPHY - TSMC N3P 1.2V x1, North/South (vertical) poly orientation
- Ported to over 50 different processes and configurations ranging from 65-nm to 14/16-nm FinFET
 - Supports the USB 2.0 protocol and data rate (480 Mbps)
 - Supports the USB Type-C specification
 - USB femtoPHY, USB nanoPHY and USB picoPHY offer a tunability feature that allows quick, post-silicon adjustments that occur due to process variations, or unexpected chip and board parasitic, without modifying the existing design
 
					
	 - 
		eUSB 2.0 PHY - TSMC N3P x1, North/South (vertical) poly orientation
- Designed for 7nm processes and below
 - Supports the USB 2.0 protocol and High Speed, Full Speed, and Low Speed data rates
 - eUSB2 PHYs supports USB 2.0, 3.0, 3.1 and 3.2 Device, Host and Dual Role configurations
 
					
	 - 
		eUSB 2.0 PHY - TSMC N3E x1, North/South (vertical) poly orientation
- Designed for 7nm processes and below
 - Supports the USB 2.0 protocol and High Speed, Full Speed, and Low Speed data rates
 - eUSB2 PHYs supports USB 2.0, 3.0, 3.1 and 3.2 Device, Host and Dual Role configurations
 
					
	 - 
		USB-C 3.2 DP/TX PHY for TSMC N3P, North/South poly orientation
- USB-IF certified Synopsys USB 3.2 solution
 - VESA certified Synopsys DisplayPort 1.4 Tx solution
 - Industry’s only USB Type-C IP solution consisting of USB-C 3.2/DisplayPort 1.4 TX PHYs, USB-C 3.2/DisplayPort 1.4 TX controllers with HDCP 2.2 and HDCP 2.2 content protection, verification IP, and IP subsystems
 - Solution supports USB Type-C, SuperSpeed USB 3.2 at 20 Gbps, SuperSpeed USB 3.1 at 10 Gbps, SuperSpeed USB 3.0 at 5 Gbps and High-Speed USB (USB 2.0) as well as DisplayPort 1.4 TX supporting RBR, HBR1, HBR2 and HBR3 bitrates
 
					
	 - 
		USB-C 3.2 DP/TX PHY, AR - TSMC N3P 1.2V , North/South poly orientation
- USB-IF certified Synopsys USB 3.2 solution
 - VESA certified Synopsys DisplayPort 1.4 Tx solution
 - Industry’s only USB Type-C IP solution consisting of USB-C 3.2/DisplayPort 1.4 TX PHYs, USB-C 3.2/DisplayPort 1.4 TX controllers with HDCP 2.2 and HDCP 2.2 content protection, verification IP, and IP subsystems
 - Solution supports USB Type-C, SuperSpeed USB 3.2 at 20 Gbps, SuperSpeed USB 3.1 at 10 Gbps, SuperSpeed USB 3.0 at 5 Gbps and High-Speed USB (USB 2.0) as well as DisplayPort 1.4 TX supporting RBR, HBR1, HBR2 and HBR3 bitrates
 
					
	 - 
		USB 3.1 PHY (10G/5G) - TSMC N3P X1 OTG, North/South Poly Orientation
- Part of a complete IP solution including xHCI host and device controllers, PHYs, verification IP, 1 IP Prototyping Kits and IP software development kits
 - Designed for advanced 1.8V CMOS planar bulk and FinFET process nodes
 - USB-C 3.1 PHY IP supports USB Type-C specification
 - Supports the SuperSpeedPlus (10 Gbps) and SuperSpeed (5 Gbps) speed modes