Why SoC Design Teams Still Struggle in a Connected World
Global design teams now have more ways than ever to communicate with one another. We have real-time collaboration, video-conferencing, the cloud, virtualization, mobility, texting, email, VoIP, and source control.
Everybody is now available anywhere at any time of the day.
We have the ability to track what everybody is doing and devise new ways of improving productivity.
Why, then, is it still so difficult to complete System-on-a-Chip designs?
The process of integrating the efforts of globally distributed design teams into a single SoC is still a daunting task. It was identified as a top challenge in a recent survey of Arteris customers, and it is easy to see why. Integration of the work of distributed teams is a major cause of delays in getting to market. Delays represent lost revenue and missed opportunity.
No doubt all of these revolutionary collaboration platforms have helped the industry reduce difficulties in communication between geographically distributed design centers. They have lowered travel barriers, eroded time zone differences, and cut through geographical divides.
Any company can enable its top designers to work anywhere in the world.
To read the full article, click here
Related Semiconductor IP
- LPDDR6/5X/5 PHY V2 - Intel 18A-P
- MIPI SoundWire I3S Peripheral IP
- LPDDR6/5X/5 Controller IP
- Post-Quantum ML-KEM IP Core
- MIPI SoundWire I3S Manager IP
Related Blogs
- Why Focus Solely on CPU & GPU When Reducing SoC Power?
- The Arm Ecosystem: More than Just an Ecosystem, it's Oxygen for SoC Design Teams
- Why eMMC is still a good low-budget storage option?
- Ensuring Integrity: The Role of SoC Security in Today's Digital World
Latest Blogs
- ML-DSA explained: Quantum-Safe digital Signatures for secure embedded Systems
- Efficiency Defines The Future Of Data Movement
- Why Standard-Cell Architecture Matters for Adaptable ASIC Designs
- ML-KEM explained: Quantum-safe Key Exchange for secure embedded Hardware
- Rivos Collaborates to Complete Secure Provisioning of Integrated OpenTitan Root of Trust During SoC Production