TSMC Symposium: EDA/IP Ecosystem Primed for 16, 10nm Nodes
SAN JOSE, Calif. -- 28nm may still be considered the mainstream node, but for leading-edge designers, there is a clear and compelling path from there through 16nm and into even the 10nm design ecosystem.
That was the message last week from Suk Lee, Senior Director, Design Infrastructure Marketing Division, TSMC, who spoke at the annual TSMC Symposium here.
Whether it's design infrastructure (design rules, PDKs, reference flows, and so forth) or IP, TSMC has charted a course deep into the FinFET era that will take design teams well into 2020 and beyond.
Some highlights from Lee's presentation:
To read the full article, click here
Related Semiconductor IP
- USB 2.0 femtoPHY -TSMC N6 18 x1, OTG, North/South (vertical) poly orientation
- USB 2.0 femtoPHY - TSMC N5 12 x1, North/South (vertical) poly orientation
- USB 2.0 femtoPHY - TSMC N3P 1.2V x1, North/South (vertical) poly orientation
- USB 2.0 picoPHY - TSMC 90LPFS33 x1, OTG
- USB 2.0 femtoPHY - TSMC 7FF18 x1, OTG, North/South (vertical) poly orientation
Related Blogs
- TSMC on Collaboration: JIT Ecosystem Development
- Altera Back to TSMC at 10nm? Xilinx Staying There
- Intel to Skip 10nm to Stay Ahead of TSMC and Samsung?
- Key Takeaways from the TSMC Technology Symposium Part 1
Latest Blogs
- Cadence Announces Industry's First Verification IP for Embedded USB2v2 (eUSB2v2)
- The Industry’s First USB4 Device IP Certification Will Speed Innovation and Edge AI Enablement
- Understanding Extended Metadata in CXL 3.1: What It Means for Your Systems
- 2025 Outlook with Mahesh Tirupattur of Analog Bits
- eUSB2 Version 2 with 4.8Gbps and the Use Cases: A Comprehensive Overview