TSMC Symposium: EDA/IP Ecosystem Primed for 16, 10nm Nodes
SAN JOSE, Calif. -- 28nm may still be considered the mainstream node, but for leading-edge designers, there is a clear and compelling path from there through 16nm and into even the 10nm design ecosystem.
That was the message last week from Suk Lee, Senior Director, Design Infrastructure Marketing Division, TSMC, who spoke at the annual TSMC Symposium here.
Whether it's design infrastructure (design rules, PDKs, reference flows, and so forth) or IP, TSMC has charted a course deep into the FinFET era that will take design teams well into 2020 and beyond.
Some highlights from Lee's presentation:
Related Semiconductor IP
- 112G PHY, TSMC N7 x4, North/South (vertical) poly orientation
- 112G Ethernet PHY, TSMC N7 x4, North/South (vertical) poly orientation
- 112G Ethernet PHY, TSMC N7 x2, North/South (vertical) poly orientation
- 112G Ethernet PHY, TSMC N7 x1, North/South (vertical) poly orientation
- 112G Ethernet PHY, TSMC N6 x2, North/South (vertical) poly orientation
Related Blogs
- TSMC on Collaboration: JIT Ecosystem Development
- Altera Back to TSMC at 10nm? Xilinx Staying There
- Intel to Skip 10nm to Stay Ahead of TSMC and Samsung?
- Key Takeaways from the TSMC Technology Symposium Part 1
Latest Blogs
- Why Choose Hard IP for Embedded FPGA in Aerospace and Defense Applications
- Migrating the CPU IP Development from MIPS to RISC-V Instruction Set Architecture
- Quintauris: Accelerating RISC-V Innovation for next-gen Hardware
- Say Goodbye to Limits and Hello to Freedom of Scalability in the MIPS P8700
- Why is Hard IP a Better Solution for Embedded FPGA (eFPGA) Technology?