Is TSMC going to smash Packaging Houses?
May 9, 2013
Two years ago TSMC announced its plans to expand into packaging services. It is unclear how much these plans succeeded up till now, but it definitely seems that TSMC is now in an excellent position to take a big bite into the advanced packaging market, enter into direct competition with ASE, AMKOR, SPIL and STATSChipPac.
Why now?
Related Semiconductor IP
- TSMC CLN3FFP HBM4 PHY
- Wi-Fi 7(be) RF Transceiver IP in TSMC 22nm
- 1.8V/3.3V I/O Library with 5V ODIO & Analog in TSMC 16nm
- HBM3 PHY V2 (Hard) - TSMC N3P
- USB4 Gen3 x2-lane PHY, TSMC N5, 1.2V, N/S orientation, type-C
Related Blogs
- How to Obtain ASIC Full Turnkey Services from TSMC and GLOBALFOUNDRIES?
- Study on semiconductor design, embedded software and services industry in India
- What does Amazon's multiday cloud outage mean for EDA cloud services?
- TSMC Reiterates 2013-14 450mm Trial Production Plan
Latest Blogs
- How Arasan’s SoundWire PHY Can Elevate Your Next Audio SoC
- Cadence Leads the Way at PCI-SIG DevCon 2025 with Groundbreaking PCIe 7.0 Demos
- Introducing the Akeana 1000 Series Processors
- How fast a GPU do you need for your user interface?
- PCIe 6.x and 112 Gbps Ethernet: Synopsys and TeraSignal Achieve Optical Interconnect Breakthroughs