Tensilica at CES
Tensilica has been attending CES for many years, before it was acquired by Cadence. The focus used to be on audio processing, with the HiFi family of processors. In fact, as I said in my preview post for this year's CES (see CES Preview), we now have over 100 licensees. More of the focus (!) is on vision and image processing. Since vision processing involves a lot of matrix multiplications, the raw number of MACs per second is an important metric. However, since these processors are often going into phones and other portable devices, the power dissipation is also critical.
The latest members of the Tensilica family of processors are:
- Vision Q6 DSP: See my post A New Era Needs a New Architecture: The Tensilica Vision Q6 DSP for details. This is targeted at doing AI processing and vision processing on the same chip.
- DNA 100 Neural Network Accelerator: See my post The New Tensilica DNA 100 Deep Neural-Network Accelerator for details. This is targeted at on-device AI, since increasingly inference is being done in edge devices.
- HiFi 5 Audio DSP" See my post "Alexa, What Is HiFi 5?" for details. This is targeted at advanced audio applications such as voice recognition.
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Related Semiconductor IP
- LPDDR6/5X/5 PHY V2 - Intel 18A-P
- ML-KEM Key Encapsulation & ML-DSA Digital Signature Engine
- MIPI SoundWire I3S Peripheral IP
- ML-DSA Digital Signature Engine
- P1619 / 802.1ae (MACSec) GCM/XTS/CBC-AES Core
Related Blogs
- CES 2019 show report
- Not your father's Tensilica
- 2011 and 2012, by Chris Rowen of Tensilica
- CES - All about software and standards
Latest Blogs
- Why What Where DIFI and the new version 1.3
- ML-DSA explained: Quantum-Safe digital Signatures for secure embedded Systems
- Efficiency Defines The Future Of Data Movement
- Why Standard-Cell Architecture Matters for Adaptable ASIC Designs
- ML-KEM explained: Quantum-safe Key Exchange for secure embedded Hardware