Experts At The Table: SoC Integration Mistakes
February 13, 2014
First of three parts: What’s missing; common problems and how to avoid them; what’s behind these errors and re-spins; proximity effects; communication breakdowns.
Semiconductor Engineering sat down to discuss integration challenges with Ruggero Castagnetti, distinguished engineer at LSI; Rob Aitken, an ARM fellow; Robert Lefferts, director of engineering in Synopsys’ Solutions Group; Bernard Murphy, chief technology officer at Atrenta; and Luigi Capodieci, R&D fellow at GlobalFoundries. What follows are excerpts of that roundtable discussion.
Related Semiconductor IP
- LPDDR6/5X/5 PHY V2 - Intel 18A-P
- ML-KEM Key Encapsulation & ML-DSA Digital Signature Engine
- MIPI SoundWire I3S Peripheral IP
- ML-DSA Digital Signature Engine
- P1619 / 802.1ae (MACSec) GCM/XTS/CBC-AES Core
Related Blogs
- SoC Integration Mistakes
- NoC for faster SoC integration
- Bluetooth 5 IP is Ready for SoC Integration
- Integration and Verification of PCIe Gen4 Root Complex IP into an Arm-Based Server SoC Application
Latest Blogs
- Accelerating Your Development: Simplify SoC I/O with a Single Multi-Protocol SerDes IP
- Why What Where DIFI and the new version 1.3
- Accelerating PCIe Gen6 L0p Verification for AI & HPC Designs using Synopsys VIP
- ML-DSA explained: Quantum-Safe digital Signatures for secure embedded Systems
- Efficiency Defines The Future Of Data Movement