Sensor Fusion and ADAS in TSMC Automotive Processes
At the recent TSMC OIP Symposium, Cadence's Tom Wong presented Sensor Fusion and ADAS SoC Designs in TSMC 16FFC and N7. These two processes are the "compact" 16nm process and the mainline 7nm process, two processes that TSMC selected for adding additional characterization and manufacturing tracking to support the automotive end-markets.
There are four big drivers in automotive electronics:
- 5G and DSRC (for V2x, and cloud communication)
- The growth of increasingly autonomous driving (broad level 2+ deployment)
- Vehicle electrification (2M in China, 1M in US, $100/kWh of battery)
- Smart mobility and ride-sharing (long term reliability)
In this post, I am going to use the term EV for electric vehicles. In China, these are called NEV, for new energy vehicle. Hybrids, whether chargeable or not, are also in there with similar requirements (along with the need for an internal combustion engine, which is not today's topic). I'm also going to assume you know your autonomous driving levels, and the tiered nature of the traditional automotive supply chain.
To read the full article, click here
Related Blogs
- Intel Versus TSMC 14nm Processes
- TSMC Processes Galore
- Biggest myth in automotive: Ethernet won't work for ADAS
- Automotive Ethernet for vision-based ADAS: Loss, cost, and latency
Latest Blogs
- Cadence Announces Industry's First Verification IP for Embedded USB2v2 (eUSB2v2)
- The Industry’s First USB4 Device IP Certification Will Speed Innovation and Edge AI Enablement
- Understanding Extended Metadata in CXL 3.1: What It Means for Your Systems
- 2025 Outlook with Mahesh Tirupattur of Analog Bits
- eUSB2 Version 2 with 4.8Gbps and the Use Cases: A Comprehensive Overview