QFN Package Overview
January 21, 2013
QFN package is probably the most successful package type today. QFN package offers low price, excellent performance and small size –therefore it is an ideal package for many applications.
QFN (quad-flat no-leads) is a plastic SMT package consists of: a leadframe, single or multiple dies, wirebonds and a molding compound. The leadframe is the heart of the package and therefore the size and the dimensions of the leadframe will determine the overall performance of the package.
Related Semiconductor IP
- Flexible Pixel Processor Video IP
- Complex Digital Up Converter
- Bluetooth Low Energy 6.0 Digital IP
- Verification IP for Ultra Ethernet (UEC)
- MIPI SWI3S Manager Core IP
Related Blogs
- Semiconductor IP Sector Overview
- PLD Overview: Xilinx and Altera
- Semiconductor Sector Overview: MRVL, IDCC, ARM, TSRA
- Can You Save 15% of you ASIC Package Cost Today? Hint: Wirebonds
Latest Blogs
- Evolution of CXL PBR Switch in the CXL Fabric
- CNNs and Transformers: Decoding the Titans of AI
- How is RISC-V’s open and customizable design changing embedded systems?
- Imagination GPUs now support Vulkan 1.4 and Android 16
- From "What-If" to "What-Is": Cadence IP Validation for Silicon Platform Success