Linley: Mobile Peaked in 2013?
April 28, 2015
Last week was the Linley Mobile Conference. Mobile is a huge semiconductor market and, outside of Intel, is the main driver for next generation process technologies. A new generation of mobile phones comes along, fills the leading edge fabs for a year or two and then moves on to the next generation. Nothing comes close to requiring so many wafers and requiring such a steep ramp.
To read the full article, click here
Related Semiconductor IP
- UCIe D2D Adapter & PHY Integrated IP
- Low Dropout (LDO) Regulator
- 16-Bit xSPI PSRAM PHY
- MIPI CSI-2 CSE2 Security Module
- ASIL B Compliant MIPI CSI-2 CSE2 Security Module
Related Blogs
- Linley Tech Mobile Conference
- And the 2013 Mobile Winner is ... Micron?
- Semiconductor Enabled Mobile Internet
- GlobalFoundries and the Mobile World Congress
Latest Blogs
- A Bench-to-In-Field Telemetry Platform for Datacenter Power Management
- IDS-Verify™: From Specification to Sign-Off – Automated CSR, Hardware Software Interface and CPU-Peripheral Interface Verification
- RISC-V and GPU Synergy in Practice: A Path Towards High-Performance SoCs from SpacemiT K3
- EDA AI Agents: Intelligent Automation in Semiconductor & PCB Design
- Why Security Can't Exist Without Trust