GlobalFoundries and the Mobile World Congress
February 22, 2010
One may ask why in the semiconductor world would GlobalFoundries (GFI) exhibit at the Mobile World Congress last week, the world’s largest exhibition for the mobile industry. And not just exhibit, GFI turned out at en force with meeting rooms and bright orange signage declaring a mobile revolution. Why? Here is your first clue:
Related Semiconductor IP
- 1.8V/3.3V I/O library with ODIO and 5V HPD in TSMC 16nm
- 1.8V/3.3V I/O Library with ODIO and 5V HPD in TSMC 12nm
- 1.8V to 5V GPIO, 1.8V to 5V Analog in TSMC 180nm BCD
- 1.8V/3.3V GPIO Library with HDMI, Aanlog & LVDS Cells in TSMC 22nm
- Specialed 20V Analog I/O in TSMC 55nm
Related Blogs
- 22FDX Shows IoT Traction at MWC 2018
- STMicroelectronics to give Globalfoundries a go
- Globalfoundries six months on: maybe we could use another foundry
- UMC versus GLOBALFOUNDRIES
Latest Blogs
- Cadence Unveils the Industry’s First eUSB2V2 IP Solutions
- Half of the Compute Shipped to Top Hyperscalers in 2025 will be Arm-based
- Industry's First Verification IP for Display Port Automotive Extensions (DP AE)
- IMG DXT GPU: A Game-Changer for Gaming Smartphones
- Rivos and Canonical partner to deliver scalable RISC-V solutions in Data Centers and enable an enterprise-grade Ubuntu experience across Rivos platforms