IP Integration : What is the difference between stitching and weaving?
As a hardware design engineer, I was never comfortable when someone talked about IP integration as ‘stitching a chip together’. First of all, it sounded like a painful process involving sharp needles, usually preceded by a painful accident. I happened to be the recipient of said stitches when, at 8 years of age, I contested a stairs post with my forehead, and sorely lost. I have to say, luckily, I have been quite adept at avoiding the needle and thread ever since. That was of course until once when, an hour before that important customer presentation, my top-shirt button, due to an over enthusiastic yawn, pinged across my hotel room floor like a nano-UFO. A panicked retrieval of the renegade button was followed quickly with a successful hunt for an elusive emergency sewing-kit. The crisis quickly dissipated as I stitched back the button in a random-but-directed type of methodology. Needle-less to say stitching, whilst sometimes necessary, makes me uncomfortable.
To read the full article, click here
Related Semiconductor IP
- USB 20Gbps Device Controller
- 25MHz to 4.0GHz Fractional-N RC PLL Synthesizer on TSMC 3nm N3P
- AGILEX 7 R-Tile Gen5 NVMe Host IP
- 100G PAM4 Serdes PHY - 14nm
- Bluetooth Low Energy Subsystem IP
Related Blogs
- Reduce Integration Risks for High-Speed Applications with PCIe 5.0-Compliant Synopsys IP
- Understanding USB IP and Its Role in SOC Integration
- I3C IP: Enabling Efficient Communication and Sensor Integration
- Advanced SoC Development Uses Next-Gen IP Integration Tools
Latest Blogs
- Cadence Powers AI Infra Summit '25: Memory, Interconnect, and Interface Focus
- Integrating TDD Into the Product Development Lifecycle
- The Hidden Threat in Analog IC Migration: Why Electromigration rules can make or break your next tapeout
- MIPI CCI over I3C: Faster Camera Control for SoC Architects
- aTENNuate: Real-Time Audio Denoising