The State of 450mm Wafers. And Intel Gossip
Paul Farrar, the General Manager of the Global 450mm Consortium (G450C) presented at the SEMI ISS conference today. What is G450C, it is a public-private consortium to develop a cost-effective 450mm wafer fabrication infrastructure, develop equipment prototypes and coordinate the industry move to 450mm. It is located in Albany New York and its main partners are Intel, TSMC, Samsung, GlobalFoundries, IBM and the state of New York. The current plans call for work to take place over the next 3 or 4 years and be ready for volume manufacturing in 2018 or 2019. At the end of last year they had 41 450mm tools either in Albany or at partner companies or at suppliers (tools just means pieces of equipment like a stepper). They have a 45,000 square foot clean room.
To read the full article, click here
Related Semiconductor IP
- PUF-based Post-Quantum Cryptography (PQC) Solution
- OPEN Alliance TC14 10BASE-T1S Topology Discovery IP
- HBM4 PHY IP
- 10-bit SAR ADC - XFAB XT018
- eFuse Controller IP
Related Blogs
- How Much Cost Reduction Will 450mm Wafers Provide
- Why do we need 450mm wafers?
- From DIY To Advanced NoC Solutions: The Future Of MCU Design
- Guarding against the threat of clock attacks with analog IP