Interface IP Cores for TSMC
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Interface IP Cores
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Interface IP Cores
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USB4 PHY - TSMC N6 1.8V, North/South Poly Orientation
- Supports 40 Gbps, 20 Gbps, 10 Gbps, and 5 Gbps data rates
- Supports 480 Mbps, 12 Mbps, and 1.5 Mbps data rates
- x1 and x2 configurations (USB 3.2 and USB 3.1 PHY only)
- Low active and standby power
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LVDS / sub-LVDS / DPHY TX - TSMC 6FFC
- The LVDS/Sub-LVDS/DPHY Combo TX converts parallel RGB data and 7/8/10 bits of CMOS parallel data into serial data streams.
- A phase-locked clock is transmitted in parallel with the data streams over a dedicated high-speed link.
- The polarity of differential signals for each data lane can be controlled.
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USB 2.0 femtoPHY -TSMC N6 18 x1, OTG, North/South (vertical) poly orientation
- Ported to over 50 different processes and configurations ranging from 65-nm to 14/16-nm FinFET
- Supports the USB 2.0 protocol and data rate (480 Mbps)
- Supports the USB Type-C specification
- USB femtoPHY, USB nanoPHY and USB picoPHY offer a tunability feature that allows quick, post-silicon adjustments that occur due to process variations, or unexpected chip and board parasitic, without modifying the existing design
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USB-C 3.1 SS/SSP PHY, Type-C - TSMC 6FF x1, North/South Poly Orientation
- Part of a complete IP solution including xHCI host and device controllers, PHYs, verification IP, 1 IP Prototyping Kits and IP software development kits
- Designed for advanced 1.8V CMOS planar bulk and FinFET process nodes
- USB-C 3.1 PHY IP supports USB Type-C specification
- Supports the SuperSpeedPlus (10 Gbps) and SuperSpeed (5 Gbps) speed modes
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USB 3.1 PHY (10G/5G) - TSMC 6FF x1 OTG, North/South Poly Orientation
- Part of a complete IP solution including xHCI host and device controllers, PHYs, verification IP, 1 IP Prototyping Kits and IP software development kits
- Designed for advanced 1.8V CMOS planar bulk and FinFET process nodes
- USB-C 3.1 PHY IP supports USB Type-C specification
- Supports the SuperSpeedPlus (10 Gbps) and SuperSpeed (5 Gbps) speed modes
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MIPI M-PHY G5 Type 1 2Tx2Rx - TSMC N6 1.8V, North/South Poly Orientation
- Compliant with MIPI M-PHY v5.0 specification
- Supports MIPI UniPro, JEDEC UFS protocols
- Supports High-Speed (HS) Gear1,
- Gear2, Gear3, Gear4 and Gear5 A/B modes
- Supports M-PHY Type-I
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MIPI M-PHY G4 Type 1 2TX2RX - TSMC 6FF 1.8V, North/South Poly Orientation
- Compliant with MIPI M-PHY v5.0 specification
- Supports MIPI UniPro, JEDEC UFS protocols
- Supports High-Speed (HS) Gear1,
- Gear2, Gear3, Gear4 and Gear5 A/B modes
- Supports M-PHY Type-I
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MIPI D-PHY Tx 4 Lanes - TSMC6ff18, North/South Poly Orientation
- Compliant with the MIPI D-PHY specification, v1.2
- Fully integrated hard macro
- Up to 2.5 Gbps per lane
- Aggregate throughput up to 10 Gbps in 4 data lanes
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MIPI D-PHY Tx 2 Lanes - TSMC6ff18, North/South Poly Orientation
- Compliant with the MIPI D-PHY specification, v1.2
- Fully integrated hard macro
- Up to 2.5 Gbps per lane
- Aggregate throughput up to 10 Gbps in 4 data lanes
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MIPI D-PHY Rx 4 Lanes - TSMC6ff18, North/South Poly Orientation
- Compliant with the MIPI D-PHY specification, v1.2
- Fully integrated hard macro
- Up to 2.5 Gbps per lane
- Aggregate throughput up to 10 Gbps in 4 data lanes
