A brief primer on embedded SoC packaging options
Deepak Behera, Sumit Varshney, Sunaina Srivastava, and Swapnil Tiwari, Freescale Semiconductor
11/20/2011 9:16 PM EST
With shrinking technology, voltage levels are being reduced, lowering noise margins required to enable a clean design from a signal integrity perspective. Higher operating frequency requirements further complicate design closure. Semiconductor packages are a quintessential piece of the signal integrity puzzle.
This article addresses the basics of packaging such as types of packages and their advantages and disadvantages, future trends, and factors to be considered while choosing a package.
To read the full article, click here
Related Semiconductor IP
- LPDDR6/5X/5 PHY V2 - Intel 18A-P
- ML-KEM Key Encapsulation & ML-DSA Digital Signature Engine
- MIPI SoundWire I3S Peripheral IP
- ML-DSA Digital Signature Engine
- P1619 / 802.1ae (MACSec) GCM/XTS/CBC-AES Core
Related Articles
- An Efficient Device for Forward Collision Warning Using Low Cost Stereo Camera & Embedded SoC
- Testing Of Repairable Embedded Memories in SoC: Approach and Challenges
- Internal JTAG - A cutting-edge solution for embedded instrument testing in SoC: Part 1
- Internal JTAG - A cutting-edge solution for embedded instrument testing in SoC: Part 2
Latest Articles
- FPGA-Accelerated RISC-V ISA Extensions for Efficient Neural Network Inference on Edge Devices
- MultiVic: A Time-Predictable RISC-V Multi-Core Processor Optimized for Neural Network Inference
- AnaFlow: Agentic LLM-based Workflow for Reasoning-Driven Explainable and Sample-Efficient Analog Circuit Sizing
- FeNN-DMA: A RISC-V SoC for SNN acceleration
- Multimodal Chip Physical Design Engineer Assistant