Wipro tops offshoring list
K.C. Krishnadas
(08/17/2004 9:00 AM EDT)
BANGALORE, India — Wipro Technologies, the software services division of conglomerate Wipro Ltd., tops a list of offshore software and business service providers, according to an industry survey.
International Data Corp., (Framingham, Mass.,) studied 21 offshore service providers as well as those offering research and development services. In a report, the market researchers ranked Wipro first using a formula that looked at each company's ability to gain market share. The study analyzed relative strengths, weaknesses and market position of the major offshore providers.
Wipro's headed a list of Indian companies that included second-ranked Tata Consultancy Services and Infosys Technologies, which ranked third in the survey.
IDC found that Wipro has the highest concentration of engineers in the higher-investment business segments such as chip design services, an area most Indian software firms avoid. Other Indian companies cited in the study were HCL Technologies, Satyam Computer Services, NIIT and Patni Computers.
Related Semiconductor IP
- 6-bit, 12 GSPS Flash ADC - GlobalFoundries 22nm
- LunaNet AFS LDPC Encoder and Decoder IP Core
- ReRAM NVM in DB HiTek 130nm BCD
- UFS 5.0 Host Controller IP
- PDM Receiver/PDM-to-PCM Converter
Related News
- World's Top Ten IC Design Company Revenue Reached US$39.43 billion in 1Q22, Marvell Growth Rate Tops List, Says TrendForce
- India's Wipro expands IC-design services by striking foundry deal with UMC
- Wipro methodology monitors IC design cycle
- 3DSP lines up software development support from India's Wipro
Latest News
- AimFuture, a Leader in Home Appliance NPUs, to Integrate Mesacure Company’s AI Algorithms
- Security in the Quantum Era: From Cryptography to Trust — ICTK Introduces a Hardware Trust Foundation for the Quantum Era
- TES unveils a next-generation Elliptic Curve Digital Signature Algorithm (ECDSA) IP Core for Secure IoT, Blockchain, and Industrial Systems
- Seligman Ventures Leads Cognichip’s $60M Series A to Back Physics-Informed AI for Chip Design, Intel CEO Lip-Bu Tan and Seligman Ventures’ Umesh Padval Join the Board
- SEMI Projects Double-Digit Growth in Global 300mm Fab Equipment Spending for 2026 and 2027