UMC Pushes 8" Manufacturing Limit with A+ Technology Solution
0.11um Al-BEoL platform the most comprehensive solution among all foundries
HSINCHU, Taiwan, December 30, 2011 -- United Microelectronics Corporation (NYSE: UMC; TWSE: 2303) ("UMC"), a leading global semiconductor foundry, today announced its A+ technology platform, a specialized 0.11um aluminum process manufactured in UMCâs 8â fabs. UMC is the only foundry to offer the most complete 0.11um full aluminum BEoL (Back End of Line) process, providing customers with a cost effective alternative to mainstream 0.13um and 0.11um copper technologies. The unique A+ platform consists of a comprehensive blend of technology offerings that no other foundry can provide, which include logic/MM, RFCMOS, eFlash, eE2PROM, eHV and CIS to address customersâ integration, performance, and cost requirements.
Steve Wang, vice president of Asian sales and Corporate Marketing at UMC, said, âThere are many applications still enjoying a comfort zone within 8â manufacturing facilities due to the attractive cost vs. performance benefits. For applications such as timing controllers, LCD controllers, remote controller, small panel display drivers, surveillance and medical CMOS Image sensors, etc., A+ is the perfect technology sweet spot. With its comprehensive technology portfolio, the A+ solution offers an ideal migration path for 0.18um or existing 0.13/0.11um Cu-BEoL products so that customers can differentiate their market position for increased competitiveness.â
The unique A+ 0.11um specialty platform incorporates state-of-the-art solutions to help designers find an optimal balance between cost, performance, and functionality. A+ combines the most leading-edge 8â production technology with aggressive Al-BEOL design rules. A full suite of IP, HV-LDMOS, I/O devices, RF models and passive components complete the comprehensive A+ offering, with flexible 8-inch manufacturing capacity to support customer production requirements.
About UMC
UMC (NYSE: UMC, TSE: 2303) is a leading global semiconductor foundry that provides advanced technology and manufacturing services for applications spanning every major sector of the IC industry. UMCâs customer-driven foundry solutions allow chip designers to leverage the strength of the companyâs leading-edge processes, which include production proven 65nm, 45/40nm, mixed signal/RFCMOS, and a wide range of specialty technologies. Production is supported through 10 wafer manufacturing facilities that include two advanced 300mm fabs; Fab 12A in Taiwan and Singapore-based Fab 12i are both in volume production for a variety of customer products. The company employs approximately 14,000 people worldwide and has offices in Taiwan, Japan, Singapore, Europe, and the United States. UMC can be found on the web at http://www.umc.com.
Related Semiconductor IP
- 5G-NTN Modem IP for Satellite User Terminals
- 14-bit 12.5MSPS SAR ADC - Tower 65nm
- 5G-Advanced Modem IP for Edge and IoT Applications
- TSN Ethernet Endpoint Controller 10Gbps
- 13ns High-Speed Comparator with no Hysteresis
Related News
- New IC Manufacturing Lines to Boost Total Industry Wafer Capacity 8%
- EnSilica Agrees a Multimillion Pound Design and Manufacturing Services Contract
- Alphacore is gearing up for a high-impact presence at the 2025 Diminishing Manufacturing Sources and Material Shortages & Parts Management Consortium
- SkyWater Technology Expands Leadership in U.S. Semiconductor Manufacturing with Infineon IP License Agreement
Latest News
- TES offers new High-Speed Comparator IPs for X-FAB XT018 - 0.18µm BCD-on-SOI technology.
- QuickLogic Reports Fiscal Fourth Quarter and Full Year 2025 Financial Results
- MIPS, GlobalFoundries Bet on Physical AI
- IPrium releases LunaNet AFS LDPC Encoder and Decoder for Lunar Navigation Satellite Systems
- Quintauris Introduces Altair: The Unified RISC-V Profile for Embedded Systems