TSMC lays out a killer roadmap
By David Manners, ElectronicsWeekly (May 25, 2023)
At TSMC’s European technology symposium in Amsterdam earlier this week, the company laid out it’s advanced technology roadmap for the next three years.
Currently N3, which entered volume production in Q4 2022, is the most advanced process.
Following it up is N3E which has passed technology qualification and achieved its performance and yield targets.
To read the full article, click here
Related Semiconductor IP
- Process/Voltage/Temperature Sensor with Self-calibration (Supply voltage 1.2V) - TSMC 3nm N3P
- 25MHz to 4.0GHz Fractional-N RC PLL Synthesizer on TSMC 3nm N3P
- USB 4.0 V2 PHY - 4TX/2RX, TSMC N3P , North/South Poly Orientation
- TSMC CLN5FF GUCIe LP Die-to-Die PHY
- Flipchip 1.8V/3.3V I/O Library with ESD-hardened GPIOs in TSMC 12nm FFC/FFC+
Related News
- Artisan Components Furthers Library Roadmap with TSMC 0.13-Micron Agreement
- 1999 roadmap targets new 'performance SoC' category
- Intel and ARM Finalize Architecture Roadmap Licensing Agreement
- Actel Details Next Phase In Space-Qualified FPGA Roadmap; Aggressively Targets Satellite Payload Applications
Latest News
- Secure-IC, now a part of Cadence, unveils Securyzr™ Xperience, an Exclusive Gateway to Security Innovation
- QuickLogic Accelerates Space Innovation with Secure, Customizable eFPGA Hard IP
- SkyWater Technology and QuamCore Announce Collaboration to Fabricate Digital Superconducting Controller for Scalable Quantum Computing
- Aion Silicon Expands Barcelona Design Center to Meet Surging Demand for ASIC and SoC Solutions
- UMC Reports Sales for October 2025